Inventor · disambiguated record
Paul J. Clapis
Also filed as: CLAPIS PAUL J
2 granted patents·67 citations·filing 1993–1993
66Inventor score
Files withINTEGRATED PROCESS EQUIPMENT C2
Top patents by PatentIndex Score
2 records- 0171US5555472AMethod and apparatus for measuring film thickness in multilayer thin film stack by comparison to a reference library of theoretical signaturesINTEGRATED PROCESS EQUIPMENT C·Filed 1993·Granted Sep 10, 1996·37 cites·15 claims
- 0256US5610102AMethod for co-registering semiconductor wafers undergoing work in one or more blind process modulesINTEGRATED PROCESS EQUIPMENT C·Filed 1993·Granted Mar 11, 1997·30 cites·18 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →