Inventor · disambiguated record
Patrick Clark
Also filed as: CLARK PATRICK · CLARK PATRICK A · CLARK PATRICK ALBERT
6 granted patents·39 citations·filing 2001–2013
78Inventor score
Top patents by PatentIndex Score
6 records- 0188US7972650B1Method for manufacturing 3D circuits from bare die or packaged IC chips by microdispensed interconnectionsNSCRYPT INC·Filed 2006·Granted Jul 5, 2011·31 cites·30 claims
- 0256US8790742B2Method for manufacturing 3D circuits from bare die or packaged IC chips by microdispensed interconnectionsCHURCH KENNETH H·Filed 2011·Granted Jul 29, 2014·1 cites·31 claims
- 0355US10059056B2Micro-dispensing multi-layered 3D objects with curing stepsNSCRYPT INC·Filed 2013·Granted Aug 28, 2018·2 cites·19 claims
- 0452US6812309B2Digitally encoded polymersROHM & HAAS·Filed 2002·Granted Nov 2, 2004·3 cites·7 claims
- 0549US6713557B2Redox system and processROHM & HAAS·Filed 2001·Granted Mar 30, 2004·2 cites·14 claims
- 0641US12052828B2Dispensing patterns including lines and dots at high speedsCHURCH KENNETH H·Filed 2009·Granted Jul 30, 2024·0 cites·15 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →