Inventor · disambiguated record
Paul Collander
Also filed as: COLLANDER PAUL · COLLANDER PAUL E
2 granted patents·1 pending application·46 citations·filing 1986–2002
63Inventor score
Top patents by PatentIndex Score
3 records- 0159US5872700AMulti-chip module package with insulating tape having electrical leads and solder bumpsNOKIA MOBILE PHONES LTD·Filed 1997·Granted Feb 16, 1999·34 cites·15 claims
- 0239US4766922AProcedure for forming cocks closable by freezing, belonging to a liquid batch handling unit, and handling unit set up according to the procedureFLUILOGIC SYSTEMS OY·Filed 1986·Granted Aug 30, 1988·12 cites·12 claims
- 0325US2003198032A1Integrated circuit assembly and method for making sameFiled 2002·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →