Inventor · disambiguated record
Paul E. Dufresne
Also filed as: DUFRESNE PAUL · DUFRESNE PAUL E
8 granted patents·98 citations·filing 1977–2017
87Inventor score
Top patents by PatentIndex Score
8 records- 0165US5447619ACopper foil for the manufacture of printed circuit boards and method of producing the sameCIRCUIT FOIL USA INC·Filed 1993·Granted Sep 5, 1995·30 cites·9 claims
- 0265USD251125SCartridge for strip materialMINNESOTA MINING & MFG·Filed 1977·Granted Feb 20, 1979·9 cites·1 claims
- 0359US6224991B1Process for electrodeposition of barrier layer over copper foil bonding treatment, products thereof and electrolyte useful in such processYATES FOIL USA INC·Filed 1999·Granted May 1, 2001·14 cites·11 claims
- 0455US5989727AElectrolytic copper foil having a modified shiny sideCIRCUIT FOIL USA INC·Filed 1998·Granted Nov 23, 1999·18 cites·14 claims
- 0548US6372113B2Copper foil and copper clad laminates for fabrication of multi-layer printed circuit boards and process for producing sameYATES FOIL USA INC·Filed 1999·Granted Apr 16, 2002·14 cites·6 claims
- 0645USD268956SCombined cartridge holder and nozzle assemblyMINNESOTA MINING & MFG·Filed 1980·Granted May 10, 1983·4 cites·1 claims
- 0742US10581105B2Fuel cells utilizing liquid metal alloy reducing agents and fuel cell systems including the sameDUFRESNE PAUL E·Filed 2017·Granted Mar 3, 2020·0 cites·25 claims
- 0840US6270645B1Simplified process for production of roughened copper foilCIRCUIT FOIL USA INC·Filed 1997·Granted Aug 7, 2001·9 cites·9 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →