Inventor · disambiguated record
Paul Frank
Also filed as: FRANK PAUL · FRANK PAUL C
11 granted patents·8 pending applications·9 citations·filing 1986–2025
82Inventor score
Files withINFINEON TECHNOLOGIES AUSTRIA AG8INFINEON TECHNOLOGIES AG7ADIENT LUXEMBOURG HOLDING SARL1AUDI AG1FRANK PAUL C1
Top patents by PatentIndex Score
19 records- 0177US12205870B2Semiconductor package and method for fabricating a semiconductor packageINFINEON TECHNOLOGIES AUSTRIA AG·Filed 2023·Granted Jan 21, 2025·0 cites·20 claims
- 0277US2025105103A1Semiconductor package including one or more solder joints electrically and mechanically coupling first and second power semiconductor chips to a leadframe part and method for fabricating thea semiconductor packageINFINEON TECHNOLOGIES AUSTRIA AG·Filed 2024·Application pending·0 cites
- 0374US12159854B2Semiconductor device having a layer stack, semiconductor arrangement and method for producing the sameINFINEON TECHNOLOGIES AUSTRIA AG·Filed 2023·Granted Dec 3, 2024·0 cites·13 claims
- 0469US2024387899A1Self-regulating cooling device for an energy storage, cooling arrangement, energy storage and motor vehicleAUDI AG·Filed 2024·Application pending·0 cites
- 0569US2024096842A1Method for Fabricating a Power Semiconductor DeviceINFINEON TECHNOLOGIES AUSTRIA AG·Filed 2023·Application pending·0 cites
- 0668US11887961B2Semiconductor device, semiconductor arrangement and method for producing the sameINFINEON TECHNOLOGIES AUSTRIA AG·Filed 2022·Granted Jan 30, 2024·0 cites·15 claims
- 0767US10741402B2Electronic device, electronic module and methods for fabricating the sameINFINEON TECHNOLOGIES AG·Filed 2017·Granted Aug 11, 2020·1 cites·13 claims
- 0866US11688670B2Semiconductor package and method for fabricating a semiconductor packageINFINEON TECHNOLOGIES AUSTRIA AG·Filed 2020·Granted Jun 27, 2023·0 cites·16 claims
- 0965US12354936B2Semiconductor device with a nickel comprising layer and method for fabricating the sameINFINEON TECHNOLOGIES AG·Filed 2022·Granted Jul 8, 2025·0 cites·10 claims
- 1064US2025266339A1Method for fabricating a semiconductor device with a nickel comprising layerINFINEON TECHNOLOGIES AG·Filed 2025·Application pending·0 cites
- 1163US11615963B2Electronic device, electronic module and methods for fabricating the sameINFINEON TECHNOLOGIES AG·Filed 2020·Granted Mar 28, 2023·0 cites·20 claims
- 1257US2021225795A1Power Semiconductor Device and Method for Fabricating a Power Semiconductor DeviceINFINEON TECHNOLOGIES AUSTRIA AG·Filed 2021·Application pending·0 cites
- 1353US11581194B2Sintering method using a sacrificial layer on the backside metallization of a semiconductor dieINFINEON TECHNOLOGIES AG·Filed 2021·Granted Feb 14, 2023·0 cites·11 claims
- 1452US2024030502A1Semiconductor device, battery management system and method of producing a semiconductor deviceINFINEON TECHNOLOGIES AUSTRIA AG·Filed 2023·Application pending·0 cites
- 1546US2025253280A1Sinterable electrical contact on a semiconductor substrateINFINEON TECHNOLOGIES AG·Filed 2025·Application pending·0 cites
- 1641US4686897AHydraulic bench pressFRANK PAUL C·Filed 1986·Granted Aug 18, 1987·8 cites·20 claims
- 1740US11046211B2Spring assembly for an unlocking mechanism for a longitudinal adjustment system for a vehicle seat and method for installing a spring assemblyADIENT LUXEMBOURG HOLDING SARL·Filed 2017·Granted Jun 29, 2021·0 cites·9 claims
- 1833US8459605B2Rail system and vehicle seatSCHMALE UWE·Filed 2007·Granted Jun 11, 2013·0 cites·19 claims
- 1933US2016126165A1Method of connecting a substrate and chip assemblyINFINEON TECHNOLOGIES AG·Filed 2015·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →