Inventor · disambiguated record
Paulus Martinus Catharina Hesen
Also filed as: HESEN PAULUS M C · HESEN PAULUS MARTINUS CATHARINA
4 granted patents·1 pending application·14 citations·filing 2004–2014
68Inventor score
Technology areasH10W
Files withHESEN PAULUS M C1HESEN PAULUS MARTINUS CATHARINA1KONINKL PHILIPS ELECTRONICS NV1NXP BV1VAN DE WATER PETER WILHELMUS MARIA1
Top patents by PatentIndex Score
5 records- 0186US9222989B2Manufacturing methods for a sensor package including a lead frameNXP BV·Filed 2014·Granted Dec 29, 2015·9 cites·8 claims
- 0262US8664946B2Sensor packages including a lead frame and moulding body and methods of manufacturingHESEN PAULUS MARTINUS CATHARINA·Filed 2008·Granted Mar 4, 2014·4 cites·6 claims
- 0348US8884410B2Method for manufacturing a microelectronic package comprising at least one microelectronic deviceVAN DE WATER PETER WILHELMUS MARIA·Filed 2009·Granted Nov 11, 2014·1 cites·2 claims
- 0434US2006157829A1Lead frame, semiconductor device comprising the lead frame and method of manufacturing a semiconductor device with the leadframeKONINKL PHILIPS ELECTRONICS NV·Filed 2004·Application pending·0 cites
- 0529US8232628B2Method for manufacturing a microelectronic package comprising at least one microelectronic deviceHESEN PAULUS M C·Filed 2008·Granted Jul 31, 2012·0 cites·13 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →