Inventor · disambiguated record
Padam Jain
Also filed as: JAIN PADAM
11 granted patents·7 pending applications·7 citations·filing 2014–2025
82Inventor score
Top patents by PatentIndex Score
18 records- 0185US11488890B2Direct liquid cooling with O-ring sealingGOOGLE LLC·Filed 2020·Granted Nov 1, 2022·2 cites·21 claims
- 0284US11990386B2Methods and heat distribution devices for thermal management of chip assembliesGOOGLE LLC·Filed 2021·Granted May 21, 2024·1 cites·18 claims
- 0383US12243802B2Methods and heat distribution devices for thermal management of chip assembliesGOOGLE LLC·Filed 2024·Granted Mar 4, 2025·0 cites·7 claims
- 0480US10964625B2Device and method for direct liquid cooling via metal channelsGOOGLE LLC·Filed 2019·Granted Mar 30, 2021·3 cites·31 claims
- 0571US12272619B2Direct liquid cooling with O-ring sealingGOOGLE LLC·Filed 2022·Granted Apr 8, 2025·0 cites·16 claims
- 0661US11721641B2Weight optimized stiffener and sealing structure for direct liquid cooled modulesGOOGLE LLC·Filed 2020·Granted Aug 8, 2023·0 cites·18 claims
- 0757US12424509B2Compliant pad spacer for three-dimensional integrated circuit packageGOOGLE LLC·Filed 2022·Granted Sep 23, 2025·0 cites·13 claims
- 0857US9788416B2Multilayer substrate for semiconductor packagingINTEL CORP·Filed 2014·Granted Oct 10, 2017·1 cites·23 claims
- 0955US11955406B2Temperature control element utilized in device die packagesGOOGLE LLC·Filed 2022·Granted Apr 9, 2024·0 cites·17 claims
- 1052US2024379731A1Ferromagnetic material based integrated inductor in siliconNVIDIA CORP·Filed 2023·Application pending·0 cites
- 1151US2024222213A1Embedded silicon-based device components in a thick core substrate of an integrated circuit packageNVIDIA CORP·Filed 2022·Application pending·0 cites
- 1251US2024222221A1Mixed phase thermal interface material assembly with high thermal conductivity and low internal contact resistanceNVIDIA CORP·Filed 2023·Application pending·0 cites
- 1351US2024121931A1Methods and Structures for Coupling Thermal Dissipating Elements and Thermal Cooling Structures to Integrated Circuit DiesGOOGLE LLC·Filed 2023·Application pending·0 cites
- 1450US2025343099A1Hybrid Material Lid, Heat Sink, or Cold Plate for Semiconductor PackagesNVIDIA CORP·Filed 2025·Application pending·0 cites
- 1546US12315782B2Spring loaded compliant coolant distribution manifold for direct liquid cooled modulesGOOGLE LLC·Filed 2020·Granted May 27, 2025·0 cites·7 claims
- 1640US9832865B2Methods and devices for providing increased routing flexibility in multi-layer printed circuit boardsAVAGO TECHNOLOGIES GENERAL IP·Filed 2016·Granted Nov 28, 2017·0 cites·20 claims
- 1732US2017215278A1Coreless substrate having primer layers adjacent to bottom and top outer metal layersAVAGO TECHNOLOGIES GENERAL IP·Filed 2016·Application pending·0 cites
- 1832US2017223839A1Printed circuit board with compartmental shields for electronic components and methods of fabricating the sameAVAGO TECHNOLOGIES GENERAL IP·Filed 2016·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →