Inventor · disambiguated record
Patrick Krüger
Also filed as: KRÜGER PATRICK
0 granted patents·2 pending applications·0 citations·filing 2022–2024
Files withIHP GMBH INNOVATIONS FOR HIGH PERFORMANCE MICROELECTRONICS / LEIBNIZ INST FUR INNOVATIVE MIKRO1IHP GMBH INNOVATIONS FOR HIGH PERFORMANCE MICROELECTRONICS/LEIBNIZ INST FUER INNOVATIVE MIKROELEKT1
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2 records- 0145US2025022839A1Method and system of performing collective die-to-wafer bondingIHP GMBH INNOVATIONS FOR HIGH PERFORMANCE MICROELECTRONICS/LEIBNIZ INST FUER INNOVATIVE MIKROELEKT·Filed 2024·Application pending·0 cites
- 0236US2023187301A1Fan-out wafer-level packageIHP GMBH INNOVATIONS FOR HIGH PERFORMANCE MICROELECTRONICS / LEIBNIZ INST FUR INNOVATIVE MIKRO·Filed 2022·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →