Inventor · disambiguated record
Pang-Yen Lee
Also filed as: LEE PANG-YEN
6 granted patents·3 pending applications·3 citations·filing 2016–2017
68Inventor score
Files withWAFER MEMS CO LTD9
Top patents by PatentIndex Score
9 records- 0177US9812521B2Embedded passive chip device and method of making the sameWAFER MEMS CO LTD·Filed 2016·Granted Nov 7, 2017·3 cites·6 claims
- 0248US10224389B2Embedded passive chip device and method of making the sameWAFER MEMS CO LTD·Filed 2017·Granted Mar 5, 2019·0 cites·6 claims
- 0344US2018033675A1Patterned Wafer and Method of Making the SameWAFER MEMS CO LTD·Filed 2017·Application pending·0 cites
- 0443US2018019296A1Passive Chip Device and Method of Making the SameWAFER MEMS CO LTD·Filed 2017·Application pending·0 cites
- 0542US2016379969A1Patterned Wafer and Method of Making the SameWAFER MEMS CO LTD·Filed 2016·Application pending·0 cites
- 0641US9806145B2Passive chip device and method of making the sameWAFER MEMS CO LTD·Filed 2016·Granted Oct 31, 2017·0 cites·10 claims
- 0740US10109408B2Magnetic patterned wafer used for production of magnetic-core-inductor chip bodies and methods of making the sameWAFER MEMS CO LTD·Filed 2016·Granted Oct 23, 2018·0 cites·9 claims
- 0834US10020114B2Method of making a high frequency inductor chipWAFER MEMS CO LTD·Filed 2016·Granted Jul 10, 2018·0 cites·14 claims
- 0929US10181378B2Magnetic core inductor chip and method of making the sameWAFER MEMS CO LTD·Filed 2016·Granted Jan 15, 2019·0 cites·12 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →