Inventor · disambiguated record
Pang-Chun Lin
Also filed as: LIN PANG · LIN PANG-CHUN
14 granted patents·4 pending applications·148 citations·filing 2010–2024
89Inventor score
Top patents by PatentIndex Score
18 records- 0196US7934313B1Package structure fabrication methodSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2010·Granted May 3, 2011·132 cites·32 claims
- 0281US8304268B2Fabrication method of semiconductor package structureLIN PANG-CHUN·Filed 2010·Granted Nov 6, 2012·5 cites·22 claims
- 0377US9177837B2Fabrication method of semiconductor package having electrical connecting structuresSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2014·Granted Nov 3, 2015·3 cites·13 claims
- 0472US9362217B2Package on package structure and fabrication method thereofSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2014·Granted Jun 7, 2016·3 cites·10 claims
- 0569US8421199B2Semiconductor package structureLIN PANG-CHUN·Filed 2010·Granted Apr 16, 2013·2 cites·8 claims
- 0669US8390118B2Semiconductor package having electrical connecting structures and fabrication method thereofLIN PANG-CHUN·Filed 2010·Granted Mar 5, 2013·2 cites·9 claims
- 0760US8525336B2Semiconductor package and method of fabricating the sameLIN PANG-CHUN·Filed 2012·Granted Sep 3, 2013·1 cites·5 claims
- 0858US2025174587A1Conductive bump and method for fabricating the sameSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2024·Application pending·0 cites
- 0954US8981575B2Semiconductor package structureSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2013·Granted Mar 17, 2015·0 cites·9 claims
- 1054US8716861B2Semiconductor package having electrical connecting structures and fabrication method thereofSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2013·Granted May 6, 2014·0 cites·7 claims
- 1151US9029203B2Method of fabricating semiconductor packageSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2013·Granted May 12, 2015·0 cites·6 claims
- 1244US8873244B2Package structureLIN PANG-CHUN·Filed 2010·Granted Oct 28, 2014·0 cites·22 claims
- 1342US9171741B2Packaging substrate and fabrication method thereofWANG WEI-PING·Filed 2012·Granted Oct 27, 2015·0 cites·11 claims
- 1441US9318354B2Semiconductor package and fabrication method thereofSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2013·Granted Apr 19, 2016·0 cites·16 claims
- 1541US2014239475A1Packaging substrate, semiconductor package and fabrication methods thereofSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2013·Application pending·0 cites
- 1639US9455159B2Fabrication method of packaging substrateSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2015·Granted Sep 27, 2016·0 cites·5 claims
- 1739US2013164208A1Methods of forming grapheneHSIEH YU-TSE·Filed 2012·Application pending·0 cites
- 1838US2013009311A1Semiconductor carrier, package and fabrication method thereofSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2011·Application pending·0 cites
Join the waitlist — get patent alerts
Get an alert when Pang-Chun Lin files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →