Inventor · disambiguated record
Paul Morganelli
Also filed as: MORGANELLI PAUL · MORGANELLI PAUL L
6 granted patents·8 pending applications·100 citations·filing 1994–2015
83Inventor score
Top patents by PatentIndex Score
14 records- 0180US7047633B2Method of using pre-applied underfill encapsulantNAT STARCH CHEM INVEST·Filed 2003·Granted May 23, 2006·32 cites·32 claims
- 0273US5454909ALow-density hot melt adhesiveDEXTER CORP·Filed 1994·Granted Oct 3, 1995·35 cites·18 claims
- 0365US6624216B2No-flow underfill encapsulantNAT STARCH CHEM INVEST·Filed 2002·Granted Sep 23, 2003·17 cites·39 claims
- 0458US9441070B2Divinylarene dioxide compositions having reduced volatilityROHM & HAAS ELECT MAT·Filed 2013·Granted Sep 13, 2016·0 cites·12 claims
- 0555US6978540B2Method for pre-applied thermoplastic reinforcement of electronic componentsNAT STARCH CHEM INVEST·Filed 2003·Granted Dec 27, 2005·8 cites·12 claims
- 0638US2005074547A1Method of using pre-applied underfill encapsulantFiled 2004·Application pending·0 cites
- 0736US2006142424A1Foamable underfill encapsulantSHAH JAYESH·Filed 2006·Application pending·0 cites
- 0834US2003162911A1No flow underfill compositionFiled 2002·Application pending·0 cites
- 0932US2004235996A1Foamable underfill encapsulantFiled 2003·Application pending·0 cites
- 1031US5672677ALong open time polyamide compositionsDEXTER CORP·Filed 1996·Granted Sep 30, 1997·8 cites·20 claims
- 1131US2015221527A1Encapsulant compositionROHM & HAAS ELECT MAT·Filed 2015·Application pending·0 cites
- 1229US2004245611A1Pre-applied thermoplastic reinforcement for electronic componentsFiled 2004·Application pending·0 cites
- 1329US2004238925A1Pre-applied thermoplastic reinforcement for electronic componentsFiled 2004·Application pending·0 cites
- 1428US2004232530A1Pre-applied thermoplastic reinforcement for electronic componentsFiled 2003·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →