Inventor · disambiguated record
Pawel Mrozek
Also filed as: MROZEK PAWEL
6 granted patents·11 pending applications·26 citations·filing 2013–2025
78Inventor score
Top patents by PatentIndex Score
17 records- 0196US11742314B2Reliable hybrid bonded apparatusADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC·Filed 2021·Granted Aug 29, 2023·11 cites·21 claims
- 0294US12300661B2Reliable hybrid bonded apparatusADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC·Filed 2023·Granted May 13, 2025·2 cites·20 claims
- 0391US9450115B2Method of manufacturing a photovoltaic deviceFIRST SOLAR INC·Filed 2014·Granted Sep 20, 2016·12 cites·17 claims
- 0489US12283490B1Integrated cooling assemblies for advanced device packaging and methods of manufacturing the sameADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC·Filed 2023·Granted Apr 22, 2025·1 cites·14 claims
- 0576US2025226356A1Reliable hybrid bonded apparatusADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC·Filed 2025·Application pending·0 cites
- 0666US2025336686A1Integrated cooling assemblies for advanced device packaging and methods of manufacturing the sameADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC·Filed 2025·Application pending·0 cites
- 0763US12500138B2Cooling channel shape with substantially constant cross sectional areaADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC·Filed 2024·Granted Dec 16, 2025·0 cites·20 claims
- 0862US2025253207A1Fabrication methods and structures for liquid cooling channel chipADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC·Filed 2024·Application pending·0 cites
- 0960US2025309049A1Integrated cooling assemblies with multifunctional layers and methods of manufacturing the sameADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC·Filed 2024·Application pending·0 cites
- 1059US2025096191A1Direct bonding methods and structures for diesADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC·Filed 2023·Application pending·0 cites
- 1158US2024222316A1Hybrid bonding with sonic energyADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC·Filed 2023·Application pending·0 cites
- 1255US2023299029A1Expansion control for bondingADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC·Filed 2023·Application pending·0 cites
- 1355US2024387419A1Direct hybrid bond pad having tapered sidewallADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC·Filed 2023·Application pending·0 cites
- 1455US2023197453A1Structure with conductive feature for direct bonding and method of forming sameADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC·Filed 2022·Application pending·0 cites
- 1554US2024213210A1System and method for using acoustic waves to counteract deformations during bondingADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC·Filed 2022·Application pending·0 cites
- 1653US9269850B2Method and apparatus for forming copper(Cu) or antimony(Sb) doped zinc telluride and cadmium zinc telluride layers in a photovoltaic deviceFIRST SOLAR INC·Filed 2013·Granted Feb 23, 2016·0 cites·20 claims
- 1745US2016141444A1METHOD AND APPARATUS FORMING COPPER (Cu) OR ANTIMONY (Sb) DOPED ZINC TELLURIDE AND CADMIUM ZINC TELLURIDE LAYERS IN A PHOTOVOLTAIC DEVICEFIRST SOLAR INC·Filed 2016·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →