Inventor · disambiguated record
Paul Qu
Also filed as: QU PAUL
4 granted patents·3 pending applications·3 citations·filing 2020–2024
57Inventor score
Top patents by PatentIndex Score
7 records- 0189US11837476B2Flip-chip package with reduced underfill areaWESTERN DIGITAL TECH INC·Filed 2020·Granted Dec 5, 2023·3 cites·9 claims
- 0255US2025385152A1Semiconductor device including an integrated wafer level heat sink window plateSANDISK TECHNOLOGIES INC·Filed 2024·Application pending·0 cites
- 0355US2025391732A1Semiconductor device including an integrated tim-on-dieSANDISK TECHNOLOGIES INC·Filed 2024·Application pending·0 cites
- 0449US2024332156A1Substrate having an increased metal trace thicknessWESTERN DIGITAL TECH INC·Filed 2023·Application pending·0 cites
- 0546US12021060B2Reducing keep-out-zone area for a semiconductor deviceWESTERN DIGITAL TECH INC·Filed 2020·Granted Jun 25, 2024·0 cites·18 claims
- 0643US12021061B2Packaged memory device with flip chip and wire bond diesWESTERN DIGITAL TECH INC·Filed 2021·Granted Jun 25, 2024·0 cites·14 claims
- 0741US12114435B2Surface mount technology method and magnetic carrier systemSANDISK TECHNOLOGIES INC·Filed 2022·Granted Oct 8, 2024·0 cites·16 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →