Inventor · disambiguated record
Paul R. Start
Also filed as: START PAUL · START PAUL R
10 granted patents·4 pending applications·22 citations·filing 2010–2024
85Inventor score
Technology areasH10W
Top patents by PatentIndex Score
14 records- 0192US10373893B2Embedded bridge with through-silicon viasINTEL CORP·Filed 2017·Granted Aug 6, 2019·9 cites·16 claims
- 0288US11049798B2Embedded bridge with through-silicon ViasINTEL CORP·Filed 2019·Granted Jun 29, 2021·4 cites·20 claims
- 0385US2025046680A1Embedded bridge with through-silicon viasINTEL CORP·Filed 2024·Application pending·0 cites
- 0479US12159813B2Embedded bridge die with through-silicon viasINTEL CORP·Filed 2023·Granted Dec 3, 2024·0 cites·18 claims
- 0575US9461014B2Methods of forming ultra thin package structures including low temperature solder and structures formed therbyINTEL CORP·Filed 2015·Granted Oct 4, 2016·2 cites·26 claims
- 0673US11587851B2Embedded bridge with through-silicon viasINTEL CORP·Filed 2021·Granted Feb 21, 2023·0 cites·22 claims
- 0771US8508040B2In-situ foam materials as integrated heat spreader (IHS) sealantSTART PAUL R·Filed 2010·Granted Aug 13, 2013·3 cites·13 claims
- 0865US8866290B2Molded heat spreadersINTEL CORP·Filed 2013·Granted Oct 21, 2014·2 cites·25 claims
- 0963US9064971B2Methods of forming ultra thin package structures including low temperature solder and structures formed therbyINTEL CORP·Filed 2012·Granted Jun 23, 2015·1 cites·16 claims
- 1060US8703536B2In-situ foam material as integrated heat spreader (IHS) sealantSTART PAUL R·Filed 2013·Granted Apr 22, 2014·1 cites·7 claims
- 1149US11804470B2Wafer level passive heat spreader interposer to enable improved thermal solution for stacked dies in multi-chips package and warpage controlINTEL CORP·Filed 2019·Granted Oct 31, 2023·0 cites·20 claims
- 1237US2014239479A1Microelectronic package including an encapsulated heat spreaderSTART PAUL R·Filed 2013·Application pending·0 cites
- 1336US2019206753A1Bicontinuous porous ceramic composite for semiconductor package applicationsINTEL CORP·Filed 2017·Application pending·0 cites
- 1431US2019043778A1Swaging process for complex integrated heat spreadersINTEL CORP·Filed 2015·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →