Inventor · disambiguated record
Pascal Stumpf
Also filed as: STUMPF PASCAL
4 granted patents·1 citations·filing 2009–2013
56Inventor score
Technology areasH10W
Top patents by PatentIndex Score
4 records- 0149US9064707B2Bonding contact area on a semiconductor substrateZIMMER HANS-GUENTER·Filed 2012·Granted Jun 23, 2015·1 cites·12 claims
- 0246US8822253B2Semiconductor housing and method for the production of a semiconductor housingMICRONAS GMBH·Filed 2013·Granted Sep 2, 2014·0 cites·9 claims
- 0334US8604599B2Semiconductor housing and method for the production of a semiconductor housingKOLLETH TOBIAS·Filed 2012·Granted Dec 10, 2013·0 cites·20 claims
- 0434US8174104B2Semiconductor arrangement having specially fashioned bond wiresSTUMPF PASCAL·Filed 2009·Granted May 8, 2012·0 cites·12 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →