Inventor · disambiguated record
Pao-Yun Tang
Also filed as: TANG PAO-YUN
19 granted patents·7 pending applications·343 citations·filing 1993–2014
94Inventor score
Files withHANNSTAR DISPLAY CORP9IND TECH RES INST7TANG PAO-YUN6ARCHITEK MATERIAL CO LTD2SUN WEI-HAO1
Top patents by PatentIndex Score
26 records- 0191US5749997AComposite bump tape automated bonding method and bonded structureIND TECH RES INST·Filed 1995·Granted May 12, 1998·95 cites·19 claims
- 0290US8063497B2Liquid crystal displayTANG PAO-YUN·Filed 2008·Granted Nov 22, 2011·13 cites·20 claims
- 0388US5578527AConnection construction and method of manufacturing the sameIND TECH RES INST·Filed 1995·Granted Nov 26, 1996·107 cites·17 claims
- 0480US8890198B2Conversion structure, image sensor assembly and method for fabricating conversion structureARCHITEK MATERIAL CO LTD·Filed 2013·Granted Nov 18, 2014·3 cites·14 claims
- 0579US6995474B1Electrical conducting structure and liquid crystal display device comprising the sameHANNSTAR DISPLAY CORP·Filed 2004·Granted Feb 7, 2006·29 cites·35 claims
- 0672US9372269B2Scintillator panel, radiation image sensor and method of making the sameARCHITEK MATERIAL CO LTD·Filed 2014·Granted Jun 21, 2016·3 cites·12 claims
- 0772US8921856B2TFT-Pin array substrate and assembly structure for flat-panel X-ray detectorUNIV NAT CHIAO TUNG·Filed 2013·Granted Dec 30, 2014·3 cites·22 claims
- 0870US8841781B2Chip having a driving integrated circuitTANG PAO-YUN·Filed 2011·Granted Sep 23, 2014·1 cites·18 claims
- 0969US8027008B2Liquid crystal display panel having a touch functionHANNSTAR DISPLAY CORP·Filed 2009·Granted Sep 27, 2011·2 cites·14 claims
- 1067US5861661AComposite bump tape automated bonded structureIND TECH RES INST·Filed 1997·Granted Jan 19, 1999·36 cites·10 claims
- 1165US7456475B2Display panelHANNSTAR DISPLAY CORP·Filed 2006·Granted Nov 25, 2008·2 cites·19 claims
- 1261US8373838B2Display apparatusHANNSTAR DISPLAY CORP·Filed 2007·Granted Feb 12, 2013·1 cites·16 claims
- 1356US8427622B2Liquid crystal display panel having a touch functionTANG PAO YUN·Filed 2011·Granted Apr 23, 2013·0 cites·22 claims
- 1451US2010052160A1Bump structure and method for fabricating the sameSUN WEI-HAO·Filed 2008·Application pending·0 cites
- 1547US6024274AMethod for tape automated bonding to composite bumpsIND TECH RES INST·Filed 1996·Granted Feb 15, 2000·15 cites·11 claims
- 1645US2009045528A1Semiconductor deviceHANNSTAR DISPLAY CORP·Filed 2007·Application pending·0 cites
- 1743US6194780B1Tape automated bonding method and bonded structureIND TECH RES INST·Filed 1999·Granted Feb 27, 2001·11 cites·12 claims
- 1842US8491986B2Panel module and manufacturing method thereofTANG PAO-YUN·Filed 2011·Granted Jul 23, 2013·0 cites·35 claims
- 1942US5393359AMethod and apparatus for bonding outer leads of a liquid crystal display to metal leads of a bonding tapeIND TECH RES INST·Filed 1993·Granted Feb 28, 1995·12 cites·18 claims
- 2040US6008072ATape automated bonding methodIND TECH RES INST·Filed 1995·Granted Dec 28, 1999·10 cites·10 claims
- 2140US2007103412A1Liquid crystal display having a voltage divider with a thermistorTANG PAO-YUN·Filed 2005·Application pending·0 cites
- 2237US2011134618A1Connection structure for chip-on-glass driver ic and connection method thereforHANNSTAR DISPLAY CORP·Filed 2010·Application pending·0 cites
- 2337US2005270466A1Liquid crystal display moduleTANG PAO-YUN·Filed 2004·Application pending·0 cites
- 2436US2004099959A1Conductive bump structureHANNSTAR DISPLAY CORP·Filed 2002·Application pending·0 cites
- 2534US6912699B2Testing design for flip chip connection processHANNSTAR DISPLAY CORP·Filed 2002·Granted Jun 28, 2005·0 cites·19 claims
- 2632US2006175711A1Structure and method for bonding an IC chipHANNSTAR DISPLAY CORP·Filed 2005·Application pending·0 cites
Join the waitlist — get patent alerts
Get an alert when Pao-Yun Tang files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →