Inventor · disambiguated record
Paragkumar Ajaybhai Thadesar
Also filed as: THADESAR PARAGKUMAR · THADESAR PARAGKUMAR AJAYBHAI
14 granted patents·6 pending applications·11 citations·filing 2016–2023
85Inventor score
Top patents by PatentIndex Score
20 records- 0189US11515247B2Capacitance fine tuning by fin capacitor designQUALCOMM INC·Filed 2021·Granted Nov 29, 2022·2 cites·20 claims
- 0280US10490621B1Close proximity tunable inductive elementsQUALCOMM INC·Filed 2018·Granted Nov 26, 2019·3 cites·10 claims
- 0377US11770115B2Tunable circuit including integrated filter circuit coupled to variable capacitance, and related integrated circuit (IC) packages and fabrication methodsQUALCOMM INC·Filed 2021·Granted Sep 26, 2023·1 cites·18 claims
- 0477US11658403B2Device, package and/or substrate comprising curved antennaQUALCOMM INC·Filed 2020·Granted May 23, 2023·1 cites·37 claims
- 0573US10330874B2Mixed-signal substrate with integrated through-substrate viasGEORGIA TECH RES INST·Filed 2017·Granted Jun 25, 2019·2 cites·18 claims
- 0670US10879341B2Integrated device package comprising a real time tunable inductor implemented in a package substrateQUALCOMM INC·Filed 2016·Granted Dec 29, 2020·2 cites·29 claims
- 0758US11239158B1Wire bond inductor structures for flip chip diesQUALCOMM INC·Filed 2020·Granted Feb 1, 2022·0 cites·20 claims
- 0856US12009292B2Metal-insulator-metal (MIM) capacitor structure for layer count reduction and lower capacitance variationQUALCOMM INC·Filed 2021·Granted Jun 11, 2024·0 cites·18 claims
- 0954US12016247B2Package comprising an integrated passive device configured as a cap for a filterQUALCOMM INC·Filed 2020·Granted Jun 18, 2024·0 cites·22 claims
- 1053US12027476B2Package comprising substrate with coupling element for integrated devicesQUALCOMM INC·Filed 2022·Granted Jul 2, 2024·0 cites·10 claims
- 1153US11728293B2Chip modules employing conductive pillars to couple a passive component device to conductive traces in a metallization structure to form a passive componentQUALCOMM INC·Filed 2021·Granted Aug 15, 2023·0 cites·14 claims
- 1252US12402332B2Integrated passive devicesRF360 SINGAPORE PTE LTD·Filed 2021·Granted Aug 26, 2025·0 cites·39 claims
- 1352US2024297165A1Double-sided redistribution layer (rdl) substrate with double-sided pillars for device integrationQUALCOMM INC·Filed 2023·Application pending·0 cites
- 1451US11502652B2Substrate comprising capacitor configured for power amplifier output matchQUALCOMM INC·Filed 2020·Granted Nov 15, 2022·0 cites·27 claims
- 1551US2023352423A1Die edge protection to eliminate die chippingQUALCOMM INC·Filed 2022·Application pending·0 cites
- 1646US2022248541A1System in package (sip) socket connector interfaceQUALCOMM INC·Filed 2021·Application pending·0 cites
- 1745US2021375732A1Partial component embedding in a substrateQUALCOMM INC·Filed 2020·Application pending·0 cites
- 1839US10614942B2Inductors formed with through glass viasQUALCOMM INC·Filed 2018·Granted Apr 7, 2020·0 cites·20 claims
- 1937US2020091094A1Integrated filter technology with embedded devicesQUALCOMM INC·Filed 2018·Application pending·0 cites
- 2034US2017338179A1Device package with wire bond assisted grounding and inductorsQUALCOMM INC·Filed 2016·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →