Inventor · disambiguated record
Patrick Francis Thompson
Also filed as: THOMPSON PATRICK · THOMPSON PATRICK F · THOMPSON PATRICK FRANCIS
18 granted patents·8 pending applications·289 citations·filing 1987–2025
93Inventor score
Top patents by PatentIndex Score
26 records- 0193US11562949B2Semiconductor package including undermounted die with exposed backside metalTEXAS INSTRUMENTS INC·Filed 2020·Granted Jan 24, 2023·6 cites·29 claims
- 0289US11942386B2Electronic devices in semiconductor package cavitiesTEXAS INSTRUMENTS INC·Filed 2020·Granted Mar 26, 2024·2 cites·17 claims
- 0387US5773986ASemiconductor wafer contact system and method for contacting a semiconductor waferMOTOROLA INC·Filed 1995·Granted Jun 30, 1998·65 cites·5 claims
- 0487US5714800AIntegrated circuit assembly having a stepped interposer and methodMOTOROLA INC·Filed 1996·Granted Feb 3, 1998·96 cites·18 claims
- 0583US12347742B2IC package with heat spreaderTEXAS INSTRUMENTS INC·Filed 2024·Granted Jul 1, 2025·0 cites·20 claims
- 0682US12255115B2Electronic devices in semiconductor package cavitiesTEXAS INSTRUMENTS INC·Filed 2024·Granted Mar 18, 2025·0 cites·21 claims
- 0782US2025309036A1Ic package with heat spreaderTEXAS INSTRUMENTS INC·Filed 2025·Application pending·0 cites
- 0878US5629630ASemiconductor wafer contact system and method for contacting a semiconductor waferMOTOROLA INC·Filed 1995·Granted May 13, 1997·54 cites·27 claims
- 0975US5556808AMethod for aligning a semiconductor deviceMOTOROLA INC·Filed 1994·Granted Sep 17, 1996·54 cites·41 claims
- 1075US2025218886A1Electronic devices in semiconductor package cavitiesTEXAS INSTRUMENTS INC·Filed 2025·Application pending·0 cites
- 1173US11984418B2Method of forming brass-coated metals in flip-chip redistribution layersTEXAS INSTRUMENTS INC·Filed 2022·Granted May 14, 2024·0 cites·13 claims
- 1272US12009280B2IC package with heat spreaderTEXAS INSTRUMENTS INC·Filed 2021·Granted Jun 11, 2024·0 cites·24 claims
- 1365US8531030B2IC device having electromigration resistant feed line structuresHOWARD GREGORY ERIC·Filed 2010·Granted Sep 10, 2013·2 cites·18 claims
- 1462US11837518B2Coated semiconductor diesTEXAS INSTRUMENTS INC·Filed 2020·Granted Dec 5, 2023·0 cites·19 claims
- 1561US11616038B2Interconnect for electronic deviceTEXAS INSTRUMENTS INC·Filed 2020·Granted Mar 28, 2023·0 cites·16 claims
- 1661US11410947B2Brass-coated metals in flip-chip redistribution layersTEXAS INSTRUMENTS INC·Filed 2019·Granted Aug 9, 2022·0 cites·20 claims
- 1758US2025140624A1Packages with isolated diesTEXAS INSTRUMENTS INC·Filed 2023·Application pending·0 cites
- 1857US2025246506A1Electronic device with thermally conductive material in semiconductor die trenchTEXAS INSTRUMENTS INC·Filed 2024·Application pending·0 cites
- 1956US11855024B2Wafer chip scale packages with visible solder filletsTEXAS INSTRUMENTS INC·Filed 2021·Granted Dec 26, 2023·0 cites·22 claims
- 2056US2024395731A1Electronic device with a reinforcing layerTEXAS INSTRUMENTS INC·Filed 2023·Application pending·0 cites
- 2152US10833036B2Interconnect for electronic deviceTEXAS INSTRUMENTS INC·Filed 2018·Granted Nov 10, 2020·0 cites·18 claims
- 2251US4758368AMethod for etching silicon wafers using a potassium hydroxide and water etching solutionMOTOROLA INC·Filed 1987·Granted Jul 19, 1988·10 cites·6 claims
- 2351US2023317673A1Fan out flip chip semiconductor packageTEXAS INSTRUMENTS INC·Filed 2022·Application pending·0 cites
- 2449US12009319B2Integrated circuit with metal stop ring outside the scribe sealTEXAS INSTRUMENTS INC·Filed 2020·Granted Jun 11, 2024·0 cites·19 claims
- 2545US2021210462A1Chip scale package with redistribution layer interruptsTEXAS INSTRUMENTS INC·Filed 2020·Application pending·0 cites
- 2634US2016379953A1Semiconductor wire bonding and methodTEXAS INSTRUMENTS INC·Filed 2015·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →