Inventor · disambiguated record
Paul A. Totta
Also filed as: TOTTA PAUL A · TOTTA PAUL ANTHONY
20 granted patents·1,086 citations·filing 1976–1999
97Inventor score
Files withIBM20
Top patents by PatentIndex Score
20 records- 0194US5130779ASolder mass having conductive encapsulating arrangementIBM·Filed 1990·Granted Jul 14, 1992·185 cites·47 claims
- 0293US5503286AElectroplated solder terminalIBM·Filed 1994·Granted Apr 2, 1996·131 cites·16 claims
- 0392US5251806AMethod of forming dual height solder interconnectionsIBM·Filed 1992·Granted Oct 12, 1993·144 cites·48 claims
- 0492US5071714AMultilayered intermetallic connection for semiconductor devicesIBM·Filed 1989·Granted Dec 10, 1991·104 cites·16 claims
- 0591US5629564AElectroplated solder terminalIBM·Filed 1995·Granted May 13, 1997·111 cites·21 claims
- 0690US4081825AConduction-cooled circuit packageIBM·Filed 1977·Granted Mar 28, 1978·52 cites·16 claims
- 0787US4272561AHybrid process for SBD metallurgiesIBM·Filed 1979·Granted Jun 9, 1981·34 cites·25 claims
- 0886US4034469AMethod of making conduction-cooled circuit packageIBM·Filed 1976·Granted Jul 12, 1977·44 cites·16 claims
- 0981US5565707AInterconnect structure using a Al2 Cu for an integrated circuit chipIBM·Filed 1994·Granted Oct 15, 1996·54 cites·3 claims
- 1073US5925933AInterconnect structure using Al2 -Cu for an integrated circuit chipIBM·Filed 1996·Granted Jul 20, 1999·34 cites·10 claims
- 1173US5008730AContact stud structure for semiconductor devicesIBM·Filed 1989·Granted Apr 16, 1991·41 cites·20 claims
- 1272US5008216AProcess for improved contact stud structure for semiconductor devicesIBM·Filed 1989·Granted Apr 16, 1991·39 cites·17 claims
- 1365US6110819AInterconnect structure using Al2 Cu for an integrated circuit chipIBM·Filed 1999·Granted Aug 29, 2000·24 cites·10 claims
- 1464US5171642AMultilayered intermetallic connection for semiconductor devicesIBM·Filed 1991·Granted Dec 15, 1992·33 cites·9 claims
- 1547US5956573AUse of argon sputtering to modify surface properties by thin film depositionIBM·Filed 1997·Granted Sep 21, 1999·11 cites·19 claims
- 1643US4824009AProcess for braze attachment of electronic package membersIBM·Filed 1981·Granted Apr 25, 1989·11 cites·8 claims
- 1742US6255208B1Selective wafer-level testing and burn-inIBM·Filed 1999·Granted Jul 3, 2001·10 cites·18 claims
- 1842US4839715AChip contacts without oxide discontinuitiesIBM·Filed 1987·Granted Jun 13, 1989·13 cites·21 claims
- 1938US4583488AVariable axis rotary drive vacuum deposition systemIBM·Filed 1984·Granted Apr 22, 1986·10 cites·19 claims
- 2029US6068923AUse of argon sputtering to modify surface properties by thin film depositionIBM·Filed 1999·Granted May 30, 2000·1 cites·11 claims
Join the waitlist — get patent alerts
Get an alert when Paul A. Totta files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →