Inventor · disambiguated record
Pak Hong Yee
Also filed as: YEE PAK H · YEE PAK HONG
12 granted patents·3 pending applications·306 citations·filing 1997–2007
93Inventor score
Files withMICRON TECHNOLOGY INC5AVAGO TECH ECBU IP SG PTE LTD3TEXAS INSTRUMENTS INC3CHEN DENG-PENG2SAXENA KULDEEP KUMAR1
Top patents by PatentIndex Score
15 records- 0192US6365833B1Integrated circuit packageTEXAS INSTRUMENTS INC·Filed 2000·Granted Apr 2, 2002·70 cites·7 claims
- 0289US7842957B2Optical transceiver with reduced heightAVAGO TECH ECBU IP SG PTE LTD·Filed 2007·Granted Nov 30, 2010·25 cites·20 claims
- 0389US7514666B2Composite receiver assembly having a circuit board on which multiple receiver devices that operate on different sets of wavelengths are mountedAVAGO TECH ECBU IP SG PTE LTD·Filed 2006·Granted Apr 7, 2009·20 cites·14 claims
- 0489US6387729B2Method for adhering and sealing a silicon chip in an integrated circuit packageTEXAS INSTRUMENTS INC·Filed 2001·Granted May 14, 2002·48 cites·5 claims
- 0584US7138711B2Intrinsic thermal enhancement for FBGA packageMICRON TECHNOLOGY INC·Filed 2002·Granted Nov 21, 2006·31 cites·28 claims
- 0681US7459346B2Intrinsic thermal enhancement for FBGA packageMICRON TECHNOLOGY INC·Filed 2005·Granted Dec 2, 2008·8 cites·27 claims
- 0779US8130210B2Touch input system using light guidesSAXENA KULDEEP KUMAR·Filed 2004·Granted Mar 6, 2012·31 cites·20 claims
- 0879US6087203AMethod for adhering and sealing a silicon chip in an integrated circuit packageTEXAS INSTRUMENTS INC·Filed 1997·Granted Jul 11, 2000·45 cites·8 claims
- 0976US7521794B2Intrinsic thermal enhancement for FBGA packageMICRON TECHNOLOGY INC·Filed 2006·Granted Apr 21, 2009·5 cites·31 claims
- 1075US7030640B2Integrated circuit (IC) test assembly including phase change material for stabilizing temperature during stress testing of integrated circuits and method thereofMICRON TECHNOLOGY INC·Filed 2004·Granted Apr 18, 2006·15 cites·12 claims
- 1171US7285971B2Integrated circuit (IC) test assembly including phase change material for stabilizing temperature during stress testing of integrated circuits and method thereofMICRON TECHNOLOGY INC·Filed 2005·Granted Oct 23, 2007·5 cites·8 claims
- 1270US7495204B2Remote control receiver device and ambient light photosensor device incorporated into a single composite assemblyAVAGO TECH ECBU IP SG PTE LTD·Filed 2006·Granted Feb 24, 2009·3 cites·10 claims
- 1342US2006132454A1Systems and methods for high resolution optical touch position systemsCHEN DENG-PENG·Filed 2004·Application pending·0 cites
- 1442US2007132742A1Method and apparatus employing optical angle detectors adjacent an optical input areaCHEN DENG-PENG·Filed 2005·Application pending·0 cites
- 1541US2008013961A1Miniature composite assembly that incorporates multiple devices that use different wavelengths of light and method for making the composite assemblyYEE PAK HONG·Filed 2006·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →