Inventor · disambiguated record

Pao-Ho Yuan

Also filed as: YUAN PAO-HO

1 granted patent·37 citations·filing 2000–2000

46Inventor score

Technology areasH10P

Files withSILICONWARE PRECISION INDUSTRIES CO LTD1

Top patents by PatentIndex Score

1 record

0180US6359342B1Flip-chip bumping structure with dedicated test pads on semiconductor chip and method of fabricating the sameSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2000·Granted Mar 19, 2002·37 cites·10 claims

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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →