Inventor · disambiguated record
Pengchen Ai
Also filed as: AI PENGCHEN
0 granted patents·2 pending applications·0 citations·filing 2023–2024
Technology areasH10W
Top patents by PatentIndex Score
2 records- 0153US2025233102A1Wire bonding machine having a rotatable capillary to secure a bond wire to a connection pointSANDISK TECHNOLOGIES INC·Filed 2024·Application pending·0 cites
- 0244US2025015040A1Annular structure for an electronic flame off wandWESTERN DIGITAL TECH INC·Filed 2023·Application pending·0 cites
Join the waitlist — get patent alerts
Get an alert when Pengchen Ai files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →