Inventor · disambiguated record
Peter J. Beckage
Also filed as: BECKAGE PETER J
16 granted patents·3 pending applications·431 citations·filing 1997–2006
95Inventor score
Top patents by PatentIndex Score
19 records- 0198US6368184B1Apparatus for determining metal CMP endpoint using integrated polishing pad electrodesADVANCED MICRO DEVICES INC·Filed 2000·Granted Apr 9, 2002·190 cites·50 claims
- 0285US7378306B2Selective silicon deposition for planarized dual surface orientation integrationFREESCALE SEMICONDUCTOR INC·Filed 2006·Granted May 27, 2008·14 cites·20 claims
- 0385US6666754B1Method and apparatus for determining CMP pad conditioner effectivenessADVANCED MICRO DEVICES INC·Filed 2000·Granted Dec 23, 2003·27 cites·33 claims
- 0484US6555479B1Method for forming openings for conductive interconnectsADVANCED MICRO DEVICES INC·Filed 2001·Granted Apr 29, 2003·31 cites·48 claims
- 0582US7670895B2Process of forming an electronic device including a semiconductor layer and another layer adjacent to an opening within the semiconductor layerFREESCALE SEMICONDUCTOR INC·Filed 2006·Granted Mar 2, 2010·13 cites·20 claims
- 0682US6325705B2Chemical-mechanical polishing slurry that reduces wafer defects and polishing systemADVANCED MICRO DEVICES INC·Filed 2000·Granted Dec 4, 2001·11 cites·13 claims
- 0776US6489240B1Method for forming copper interconnectsADVANCED MICRO DEVICES INC·Filed 2001·Granted Dec 3, 2002·23 cites·14 claims
- 0875US6809032B1Method and apparatus for detecting the endpoint of a chemical-mechanical polishing operation using optical techniquesADVANCED MICRO DEVICES INC·Filed 2002·Granted Oct 26, 2004·18 cites·15 claims
- 0974US5934978AMethods of making and using a chemical-mechanical polishing slurry that reduces wafer defectsADVANCED MICRO DEVICES INC·Filed 1997·Granted Aug 10, 1999·27 cites·34 claims
- 1073US7754587B2Silicon deposition over dual surface orientation substrates to promote uniform polishingFREESCALE SEMICONDUCTOR INC·Filed 2006·Granted Jul 13, 2010·4 cites·20 claims
- 1169US6413846B1Contact each methodology and integration schemeADVANCED MICRO DEVICES INC·Filed 2000·Granted Jul 2, 2002·15 cites·36 claims
- 1262US6514858B1Test structure for providing depth of polish feedbackADVANCED MICRO DEVICES INC·Filed 2001·Granted Feb 4, 2003·8 cites·16 claims
- 1361US6051495ASeasoning of a semiconductor wafer polishing pad to polish tungstenADVANCED MICRO DEVICES INC·Filed 1997·Granted Apr 18, 2000·25 cites·57 claims
- 1457US6179688B1Method and apparatus for detecting the endpoint of a chemical-mechanical polishing operationADVANCED MICRO DEVICES INC·Filed 1999·Granted Jan 30, 2001·18 cites·52 claims
- 1552US6572443B1Method and apparatus for detecting a process endpointADVANCED MICRO DEVICES INC·Filed 2000·Granted Jun 3, 2003·5 cites·43 claims
- 1644US2007105247A1Method And Apparatus For Detecting The Endpoint Of A Chemical-Mechanical Polishing OperationADVANCED MICRO DEVICES INC·Filed 2006·Application pending·0 cites
- 1741US2007249129A1STI stressor integration for minimal phosphoric exposure and divot-free topographyFREESCALE SEMICONDUCTOR INC·Filed 2006·Application pending·0 cites
- 1836US6168640B1Chemical-mechanical polishing slurry that reduces wafer defectsADVANCED MICRO DEVICES INC·Filed 1999·Granted Jan 2, 2001·2 cites·37 claims
- 1934US2006234467A1Method of forming trench isolation in a semiconductor deviceVAN GOMPEL TONI D·Filed 2005·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →