Inventor · disambiguated record
Peter Bodo
Also filed as: BODOE PETER
5 granted patents·256 citations·filing 1997–1997
85Inventor score
Files withERICSSON TELEFON AB L M5
Top patents by PatentIndex Score
5 records- 0187US6068801AMethod for making elastic bumps from a wafer mold having groovesERICSSON TELEFON AB L M·Filed 1997·Granted May 30, 2000·62 cites·14 claims
- 0284US5998875AFlip-chip type connection with elastic contactsERICSSON TELEFON AB L M·Filed 1997·Granted Dec 7, 1999·75 cites·27 claims
- 0378US6091027AVia structureERICSSON TELEFON AB L M·Filed 1997·Granted Jul 18, 2000·60 cites·13 claims
- 0467US6188138B1Bumps in grooves for elastic positioningERICSSON TELEFON AB L M·Filed 1997·Granted Feb 13, 2001·34 cites·22 claims
- 0559US6042391AHigh density electrical connectorsERICSSON TELEFON AB L M·Filed 1997·Granted Mar 28, 2000·25 cites·5 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →