Inventor · disambiguated record
Perceval Coudrain
Also filed as: COUDRAIN PERCEVAL
14 granted patents·6 pending applications·71 citations·filing 2008–2023
87Inventor score
Files withCOMMISSARIAT ENERGIE ATOMIQUE8COUDRAIN PERCEVAL3ST MICROELECTRONICS SA3ST MICROELECTRONICS CROLLES 2 SAS2CASSET FABRICE1
Top patents by PatentIndex Score
20 records- 0194US8186568B2Assembly of two parts of an integrated electronic circuitCORONEL PHILIPPE·Filed 2008·Granted May 29, 2012·53 cites·22 claims
- 0289US9870947B1Method for collective (wafer-scale) fabrication of electronic devices and electronic deviceSTMICROELECTRONICS (GRENOBLE 2) SAS·Filed 2017·Granted Jan 16, 2018·8 cites·19 claims
- 0383US11823997B2Chip with bifunctional routing and associated method of manufacturingCOMMISSARIAT ENERGIE ATOMIQUE·Filed 2021·Granted Nov 21, 2023·1 cites·12 claims
- 0471US8828797B2Process for assembling two parts of a circuitCOUDRAIN PERCEVAL·Filed 2011·Granted Sep 9, 2014·5 cites·21 claims
- 0566US11152281B2Method of manufacturing a cooling circuit on an integrated circuit chip using a sacrificial materialCOMMISSARIAT ENERGIE ATOMIQUE·Filed 2019·Granted Oct 19, 2021·1 cites·14 claims
- 0661US8486817B2Method for forming an integrated circuit level by sequential tridimensional integrationCOUDRAIN PERCEVAL·Filed 2010·Granted Jul 16, 2013·2 cites·8 claims
- 0756US8456258B2Bulk acoustic wave resonator disposed on a substrate having a buried cavity formed therein providing different substrate thicknesses underneath the resonatorCOUDRAIN PERCEVAL·Filed 2010·Granted Jun 4, 2013·1 cites·12 claims
- 0856US7902621B2Integrated circuit comprising mirrors buried at different depthsST MICROELECTRONICS SA·Filed 2009·Granted Mar 8, 2011·0 cites·13 claims
- 0956US2024128227A1Sip-type electronic device and method for making such a deviceCOMMISSARIAT ENERGIE ATOMIQUE·Filed 2023·Application pending·0 cites
- 1052US12249572B2Integrated structure with bifunctional routing and assembly comprising such a structureCOMMISSARIAT ENERGIE ATOMIQUE·Filed 2021·Granted Mar 11, 2025·0 cites·13 claims
- 1152US2025246518A1Substrate comprising vias and associated manufacturing methodsCOMMISSARIAT ENERGIE ATOMIQUE·Filed 2023·Application pending·0 cites
- 1252US2025266322A1Substrate comprising vias and associated manufacturing methodsCOMMISSARIAT ENERGIE ATOMIQUE·Filed 2023·Application pending·0 cites
- 1352US2025197269A1Steam chamberCOMMISSARIAT A IENERGIE ATOMIQUE ET AUX ENERGIES ALTERNATIVES·Filed 2022·Application pending·0 cites
- 1452US2023132980A1Vapor chamberCOMMISSARIAT ENERGIE ATOMIQUE·Filed 2022·Application pending·0 cites
- 1551US2009014764A1Image sensor with an improved sensitivityST MICROELECTRONICS SA·Filed 2008·Application pending·0 cites
- 1644US9224708B2Method for manufacturing a conducting contact on a conducting elementCOMMISSARIAT ENERGIE ATOMIQUE·Filed 2014·Granted Dec 29, 2015·0 cites·15 claims
- 1739US9997431B2Electronic device provided with a thermal dissipation memberST MICROELECTRONICS CROLLES 2 SAS·Filed 2017·Granted Jun 12, 2018·0 cites·26 claims
- 1839US8766381B2Integrated circuit comprising a device with a vertical mobile element integrated in a support substrate and method for producing the device with a mobile elementCASSET FABRICE·Filed 2011·Granted Jul 1, 2014·0 cites·5 claims
- 1937US10480833B2Heat-transferring and electrically connecting device and electronic deviceST MICROELECTRONICS CROLLES 2 SAS·Filed 2017·Granted Nov 19, 2019·0 cites·25 claims
- 2035US9646914B2Process for producing a microfluidic circuit within a three-dimensional integrated structure, and corresponding structureST MICROELECTRONICS SA·Filed 2015·Granted May 9, 2017·0 cites·7 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →