Inventor · disambiguated record
Pey Fang Hiew
Also filed as: HIEW PEY FANG
1 granted patent·4 pending applications·3 citations·filing 2013–2023
21Inventor score
Technology areasH10W
Top patents by PatentIndex Score
5 records- 0156US8853840B2Semiconductor package with inner and outer leadsAU YIN KHENG·Filed 2013·Granted Oct 7, 2014·3 cites·11 claims
- 0252US2025069903A1Semiconductor device with embedded leadframe and method thereforNXP BV·Filed 2023·Application pending·0 cites
- 0349US2025174507A1Semiconductor device having embedded die and method thereforNXP BV·Filed 2023·Application pending·0 cites
- 0444US2024014123A1Semiconductor device with lead-on-chip interconnect and method thereforNXP BV·Filed 2022·Application pending·0 cites
- 0528US2015206829A1Semiconductor package with interior leadsAU YIN KHENG·Filed 2014·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →