Inventor · disambiguated record
Pengju Hu
Also filed as: HU PENGJU
3 granted patents·2 pending applications·0 citations·filing 2018–2023
38Inventor score
Top patents by PatentIndex Score
5 records- 0154US2025157978A1Chip transfer device, chip transfer method and magnetic die bonding penBOE MLED TECHNOLOGY CO LTD·Filed 2023·Application pending·0 cites
- 0253US12491580B2Welding-pad repair device and pad repair methodBOE MLED TECHNOLOGY CO LTD·Filed 2023·Granted Dec 9, 2025·0 cites·17 claims
- 0352US12444328B2Detachment device for spliced display device and detaching method thereofBOE MLED TECHNOLOGY CO LTD·Filed 2022·Granted Oct 14, 2025·0 cites·20 claims
- 0447US2024332458A1Display panel, display device, and manufacturing method of display panelBOE MLED TECHNOLOGY CO LTD·Filed 2022·Application pending·0 cites
- 0546US11372275B2Display panel and manufacturing method thereofBEIJING BOE OPTOELECTRONICS TECH CO LTD·Filed 2018·Granted Jun 28, 2022·0 cites·15 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →