Inventor · disambiguated record
Per Ingelhag
Also filed as: INGELHAG PER · INGELHAG PER LARS PAUL
8 granted patents·7 pending applications·4 citations·filing 2005–2022
74Inventor score
Top patents by PatentIndex Score
15 records- 0164US11497119B2Carrier substrate, an electronic assembly and an apparatus for wireless communicationERICSSON TELEFON AB L M·Filed 2018·Granted Nov 8, 2022·1 cites·19 claims
- 0256US11777619B2Dielectric waveguide signal transfer function compensationERICSSON TELEFON AB L M·Filed 2021·Granted Oct 3, 2023·0 cites·20 claims
- 0355US8199867B2Interference suppression in bit-serial data streamsJONSSON BENGT ERIK·Filed 2005·Granted Jun 12, 2012·2 cites·11 claims
- 0449US9817456B2Method and module for providing instructions for setting a supply voltageOlsson Björn·Filed 2012·Granted Nov 14, 2017·1 cites·16 claims
- 0546US12412972B2Wideband balun arrangementERICSSON TELEFON AB L M·Filed 2020·Granted Sep 9, 2025·0 cites·17 claims
- 0646US2025227011A1Approaches for apsk modulationERICSSON TELEFON AB L M·Filed 2022·Application pending·0 cites
- 0746US2025071945A1A heat spreader, and an electronic moduleERICSSON TELEFON AB L M·Filed 2022·Application pending·0 cites
- 0845US2024039491A1An amplifier arrangement with enhanced harmonic rejectionERICSSON TELEFON AB L M·Filed 2020·Application pending·0 cites
- 0944US12255701B2Method and apparatus for radio communicationsERICSSON TELEFON AB L M·Filed 2021·Granted Mar 18, 2025·0 cites·13 claims
- 1043US11777188B2Cooling in a waveguide arrangementERICSSON TELEFON AB L M·Filed 2019·Granted Oct 3, 2023·0 cites·15 claims
- 1140US12501584B2Electronic component assembly, an antenna array system, and electronic device, and a method for manufacturing an electrical component assemblyERICSSON TELEFON AB L M·Filed 2021·Granted Dec 16, 2025·0 cites·17 claims
- 1240US2025016908A1Carrier substrate, a method, and an electronic assemblyERICSSON TELEFON AB L M·Filed 2021·Application pending·0 cites
- 1339US2025015512A1Assymetric antenna-in-package for use in multiple polarizationsERICSSON TELEFON AB L M·Filed 2021·Application pending·0 cites
- 1439US2024422894A1Method of Producing a PCB, as well as a PCB, and a Circuit BoardERICSSON TELEFON AB L M·Filed 2021·Application pending·0 cites
- 1537US2025062182A1Thermal interconnect for integrated circuitryERICSSON TELEFON AB L M·Filed 2021·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →