Inventor · disambiguated record
Peng-Chung Jangjian
Also filed as: JANGJIAN PENG-CHUNG
11 granted patents·7 pending applications·21 citations·filing 2011–2025
85Inventor score
Top patents by PatentIndex Score
18 records- 0190US8367429B2Adaptive endpoint method for pad life effect on chemical mechanical polishingTAIWAN SEMICONDUCTOR MFG·Filed 2011·Granted Feb 5, 2013·14 cites·16 claims
- 0289US10714395B2Fin isolation structure for FinFET and method of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Jul 14, 2020·4 cites·20 claims
- 0386US11679469B2Chemical mechanical planarization toolTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Jun 20, 2023·2 cites·18 claims
- 0483US12172263B2Chemical mechanical planarization toolTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Dec 24, 2024·0 cites·20 claims
- 0581US11942373B2Fin isolation structure for FinFET and method of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Mar 26, 2024·0 cites·20 claims
- 0679US2025357202A1Semiconductor package redistribution structure and fabrication method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 0777US2025313723A1Composition and method for polishing and integrated circuitTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 0874US11688644B2Fin isolation structure for FinFET and method of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Jun 27, 2023·0 cites·20 claims
- 0971US10998239B2Fin isolation structure for FinFET and method of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted May 4, 2021·0 cites·20 claims
- 1069US2024282628A1Semiconductor package redistribution structure and fabrication method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
- 1166US12359090B2Composition and method for polishing and integrated circuitTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Jul 15, 2025·0 cites·20 claims
- 1264US11189727B2FinFET contacts and method forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Nov 30, 2021·1 cites·20 claims
- 1360US2025299968A1Semiconductor processing tool and methods of operationTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 1458US2024383096A1Polish Apparatus and Methods for UseTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
- 1556US12297375B2Slurry composition and method for polishing and integrated circuitTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted May 13, 2025·0 cites·20 claims
- 1656US2024391049A1Semiconductor processing tool and methods of operationTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
- 1756US2025309161A1Semiconductor device and methods of manufacturingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 1845US9333619B2Adaptive endpoint method for pad life effect on chemical mechanical polishingLEE CHU-AN·Filed 2013·Granted May 10, 2016·0 cites·20 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →