Inventor · disambiguated record
Peter G. Ledermann
Also filed as: LEDERMANN PETER G · LEDERMANN PETER GERARD
13 granted patents·994 citations·filing 1986–1998
95Inventor score
Files withIBM12
Top patents by PatentIndex Score
13 records- 0196US5117457ATamper resistant packaging for information protection in electronic circuitryIBM·Filed 1990·Granted May 26, 1992·370 cites·25 claims
- 0292US4934309ASolder deposition systemIBM·Filed 1989·Granted Jun 19, 1990·67 cites·14 claims
- 0390US5343366APackages for stacked integrated circuit chip cubesIBM·Filed 1992·Granted Aug 30, 1994·141 cites·39 claims
- 0488US5189363AIntegrated circuit testing system having a cantilevered contact lead probe pattern mounted on a flexible tape for interconnecting an integrated circuit to a testerIBM·Filed 1990·Granted Feb 23, 1993·66 cites·38 claims
- 0588US4814855ABalltape structure for tape automated bonding, multilayer packaging, universal chip interconnection and energy beam processes for manufacturing balltapeIBM·Filed 1986·Granted Mar 21, 1989·64 cites·25 claims
- 0685US5028983AMultilevel integrated circuit packaging structuresIBM·Filed 1988·Granted Jul 2, 1991·78 cites·24 claims
- 0778US4898117ASolder deposition systemIBM·Filed 1988·Granted Feb 6, 1990·36 cites·10 claims
- 0875US4970579AIntegrated circuit package with improved cooling meansIBM·Filed 1988·Granted Nov 13, 1990·46 cites·11 claims
- 0963US5065932ASolder placement nozzle with inert cover gas and inert gas bleedIBM·Filed 1990·Granted Nov 19, 1991·26 cites·7 claims
- 1062US6278784B1Intermittent errors in digital disc playersFiled 1998·Granted Aug 21, 2001·41 cites·20 claims
- 1159US5042708ASolder placement nozzle assemblyIBM·Filed 1990·Granted Aug 27, 1991·25 cites·15 claims
- 1255US4881885ADam for lead encapsulationIBM·Filed 1988·Granted Nov 21, 1989·19 cites·6 claims
- 1346US5130781ADam for lead encapsulationIBM·Filed 1990·Granted Jul 14, 1992·15 cites·5 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →