Inventor · disambiguated record
Peng Lin
Also filed as: LIN PENG · LIN PENG CHENG
19 granted patents·6 pending applications·1,697 citations·filing 1992–2025
96Inventor score
Files withNAT SEMICONDUCTOR CORP10QUALCOMM MEMS TECHNOLOGIES INC5UNIV CHINA MINING & TECHNOLOGY BEIJING2UNIV DALIAN TECH2ACQUIS TECHNOLOGY INC1
Top patents by PatentIndex Score
25 records- 0199US5495398AStacked multi-chip modules and method of manufacturingNAT SEMICONDUCTOR CORP·Filed 1995·Granted Feb 27, 1996·383 cites·4 claims
- 0299US5422435AStacked multi-chip modules and method of manufacturingNAT SEMICONDUCTOR CORP·Filed 1992·Granted Jun 6, 1995·513 cites·40 claims
- 0398US5502289AStacked multi-chip modules and method of manufacturingNAT SEMICONDUCTOR CORP·Filed 1995·Granted Mar 26, 1996·342 cites·4 claims
- 0496US8724038B2Wraparound assembly for combination touch, handwriting and fingerprint sensorGANAPATHI SRINIVASAN KODAGANALLUR·Filed 2011·Granted May 13, 2014·89 cites·27 claims
- 0590US7643305B2System and method of preventing damage to metal traces of flexible printed circuitsQUALCOMM MEMS TECHNOLOGIES INC·Filed 2008·Granted Jan 5, 2010·18 cites·25 claims
- 0690US5428245ALead frame including an inductor or other such magnetic componentNAT SEMICONDUCTOR CORP·Filed 1994·Granted Jun 27, 1995·119 cites·15 claims
- 0786US6452790B1Computer module device and methodACQUIS TECHNOLOGY INC·Filed 2000·Granted Sep 17, 2002·71 cites·6 claims
- 0868US5415331AMethod of placing a semiconductor with die collet having cavity wall recessNAT SEMICONDUCTOR CORP·Filed 1994·Granted May 16, 1995·37 cites·8 claims
- 0967US2025385409A1Battery standing method and deviceGREENSUN INC·Filed 2025·Application pending·0 cites
- 1066US5348316ADie collet with cavity wall recessNAT SEMICONDUCTOR CORP·Filed 1992·Granted Sep 20, 1994·35 cites·14 claims
- 1165US5504370AElectronic system circuit package directly supporting components on isolated subsegmentsNAT SEMICONDUCTOR CORP·Filed 1994·Granted Apr 2, 1996·34 cites·19 claims
- 1264US5339216ADevice and method for reducing thermal cycling in a semiconductor packageNAT SEMICONDUCTOR CORP·Filed 1993·Granted Aug 16, 1994·28 cites·9 claims
- 1362US12281236B2Waste-cloth-containing recovered fiber coating slurry and coating, and preparation method thereofFUJIAN HUAFENG SPORTING GOODS SCIENCE & TECH CO LTD·Filed 2020·Granted Apr 22, 2025·0 cites·3 claims
- 1460US2025304495A1Basalt fiber reinforced concrete using excavated material as aggregate and method for manufacturing sameXIAN THERMAL POWER RES INST CO·Filed 2025·Application pending·0 cites
- 1558US11536866B2Diffracted wave imaging method, device and electronic apparatusUNIV CHINA MINING & TECHNOLOGY BEIJING·Filed 2021·Granted Dec 27, 2022·0 cites·13 claims
- 1656US12242007B2Small-scale geological anomalous body detection method and deviceUNIV CHINA MINING & TECHNOLOGY BEIJING·Filed 2021·Granted Mar 4, 2025·0 cites·13 claims
- 1750US11292057B2Method for manufacturing thin-walled metal component by three- dimensional printing and hot gas bulgingUNIV DALIAN TECH·Filed 2020·Granted Apr 5, 2022·0 cites·7 claims
- 1849US5491360AElectronic package for isolated circuitsNAT SEMICONDUCTOR CORP·Filed 1994·Granted Feb 13, 1996·18 cites·18 claims
- 1948US11207732B2Integrated method for manufacturing high-temperature resistant thin-walled component by preforming by laying metal foil stripUNIV DALIAN TECH·Filed 2020·Granted Dec 28, 2021·0 cites·3 claims
- 2046US10580679B2Method of transfer printing and articles manufactured therefromUNIV MASSACHUSETTS·Filed 2016·Granted Mar 3, 2020·0 cites·11 claims
- 2145US2009323170A1Groove on cover plate or substrateQUALCOMM MEMS TECHNOLOGIES INC·Filed 2008·Application pending·0 cites
- 2245US2014177188A1Laser encapsulation of multiple dissimilar devices on a substrateQUALCOMM MEMS TECHNOLOGIES INC·Filed 2012·Application pending·0 cites
- 2342US5901043ADevice and method for reducing thermal cycling in a semiconductor packageNAT SEMICONDUCTOR CORP·Filed 1994·Granted May 4, 1999·10 cites·9 claims
- 2440US2013032385A1Metal thin shield on electrical deviceQUALCOMM MEMS TECHNOLOGIES INC·Filed 2011·Application pending·0 cites
- 2539US2011254758A1Flex Design and Attach Method for Reducing Display Panel PeripheryQUALCOMM MEMS TECHNOLOGIES INC·Filed 2010·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →