Inventor · disambiguated record
Peter S. Locke
Also filed as: LOCKE PETER · LOCKE PETER S · LOCKE PETER STEVENS
17 granted patents·2 pending applications·457 citations·filing 1999–2004
94Inventor score
Files withIBM17
Top patents by PatentIndex Score
19 records- 0191US6344125B1Pattern-sensitive electrolytic metal platingIBM·Filed 2000·Granted Feb 5, 2002·56 cites·20 claims
- 0290US6270646B1Electroplating apparatus and method using a compressible contactIBM·Filed 1999·Granted Aug 7, 2001·82 cites·22 claims
- 0389US6471845B1Method of controlling chemical bath composition in a manufacturing environmentIBM·Filed 1999·Granted Oct 29, 2002·63 cites·11 claims
- 0489US6368484B1Selective plating processIBM·Filed 2000·Granted Apr 9, 2002·56 cites·15 claims
- 0588US6344129B1Method for plating copper conductors and devices formedIBM·Filed 1999·Granted Feb 5, 2002·46 cites·17 claims
- 0686US6627052B2Electroplating apparatus with vertical electrical contactIBM·Filed 2000·Granted Sep 30, 2003·37 cites·15 claims
- 0778US6333120B1Method for controlling the texture and microstructure of plated copper and plated structureIBM·Filed 1999·Granted Dec 25, 2001·49 cites·16 claims
- 0867US6592747B2Method of controlling additives in copper plating bathsIBM·Filed 2001·Granted Jul 15, 2003·7 cites·16 claims
- 0967US6413854B1Method to build multi level structureIBM·Filed 1999·Granted Jul 2, 2002·35 cites·35 claims
- 1059US6331237B1Method of improving contact reliability for electroplatingIBM·Filed 1999·Granted Dec 18, 2001·12 cites·17 claims
- 1158US6660330B2Method for depositing metal films onto substrate surfaces utilizing a chamfered ring supportIBM·Filed 2001·Granted Dec 9, 2003·6 cites·19 claims
- 1257US7678258B2Void-free damascene copper deposition process and means of monitoring thereofIBM·Filed 2003·Granted Mar 16, 2010·1 cites·11 claims
- 1350US6979393B2Method for plating copper conductors and devices formedIBM·Filed 2002·Granted Dec 27, 2005·0 cites·3 claims
- 1448US6600230B2Seedlayer for plating metal in deep submicron structuresIBM·Filed 2001·Granted Jul 29, 2003·1 cites·1 claims
- 1544US7227265B2Electroplated copper interconnection structure, process for making and electroplating bathIBM·Filed 2004·Granted Jun 5, 2007·1 cites·21 claims
- 1644US2002027082A1Method of improving contact reliability for electroplatingFiled 2001·Application pending·0 cites
- 1738US6258717B1Method to produce high quality metal fill in deep submicron vias and linesIBM·Filed 1999·Granted Jul 10, 2001·5 cites·21 claims
- 1835US2002081842A1Electroless metal liner formation methodsFiled 2000·Application pending·0 cites
- 1934US7078247B2Early detection of contact liner integrity by chemical reactionIBM·Filed 2003·Granted Jul 18, 2006·0 cites·19 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →