Inventor · disambiguated record
Penglin Mei
Also filed as: MEI PENGLIN
4 granted patents·1 pending application·11 citations·filing 2012–2014
67Inventor score
Technology areasH10W
Top patents by PatentIndex Score
5 records- 0176US9484289B2Semiconductor device with heat spreaderGE YOU·Filed 2014·Granted Nov 1, 2016·5 cites·12 claims
- 0276US8901722B2Semiconductor device with integral heat sinkGE YOU·Filed 2013·Granted Dec 2, 2014·5 cites·19 claims
- 0359US9196576B2Semiconductor package with stress relief and heat spreaderYOW KAI YUN·Filed 2014·Granted Nov 24, 2015·1 cites·7 claims
- 0440US8980690B1Lead frame based semiconductor device with routing substrateMEI PENGLIN·Filed 2014·Granted Mar 17, 2015·0 cites·20 claims
- 0537US2013020689A1Semiconductor device and method of packaging sameFREESCALE SEMICONDUCTOR INC·Filed 2012·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →