Inventor · disambiguated record
Peter Moldauer
Also filed as: MOLDAUER PETER · MOLDAUER PETER SHAW
11 granted patents·3 pending applications·129 citations·filing 2001–2009
90Inventor score
Top patents by PatentIndex Score
14 records- 0187US6769102B2Verifying proximity of ground metal to signal traces in an integrated circuitHEWLETT PACKARD DEVELOPMENT CO·Filed 2002·Granted Jul 27, 2004·51 cites·37 claims
- 0279US6711730B2Synthesizing signal net information from multiple integrated circuit package modelsHEWLETT PACKARD DEVELOPMENT CO·Filed 2002·Granted Mar 23, 2004·17 cites·24 claims
- 0370US7075185B2Routing vias in a substrate from bypass capacitor padsHEWLETT PACKARD DEVELOPMENT CO·Filed 2004·Granted Jul 11, 2006·14 cites·15 claims
- 0469US6922822B2Verifying proximity of ground vias to signal vias in an integrated circuitHEWLETT PACKARD DEVELOPMENT CO·Filed 2002·Granted Jul 26, 2005·14 cites·30 claims
- 0566US7078812B2Routing differential signal lines in a substrateHEWLETT PACKARD DEVELOPMENT CO·Filed 2004·Granted Jul 18, 2006·13 cites·29 claims
- 0665US6807657B2Inter-signal proximity verification in an integrated circuitHEWLETT PACKARD DEVELOPMENT CO·Filed 2002·Granted Oct 19, 2004·11 cites·66 claims
- 0758US7326860B2Routing vias in a substrate from bypass capacitor padsHEWLETT PACKARD DEVELOPMENT CO·Filed 2006·Granted Feb 5, 2008·1 cites·8 claims
- 0847US6788135B1Terminating pathway for a clock signalHEWLETT PACKARD DEVELOPMENT CO·Filed 2003·Granted Sep 7, 2004·4 cites·25 claims
- 0946US7327583B2Routing power and ground vias in a substrateHEWLETT PACKARD DEVELOPMENT CO·Filed 2004·Granted Feb 5, 2008·2 cites·16 claims
- 1045US2004143531A1Synthesizing signal net information from multiple integrated circuit package modelsFiled 2004·Application pending·0 cites
- 1144US2011011634A1Circuit package with integrated direct-current (dc) blocking capacitorAVAGO TECHNOLOGIES ENTPR IP SINGAPORE PTE LTD·Filed 2009·Application pending·0 cites
- 1241US6861912B1Oscillator method and apparatus for a test chipHEWLETT PACKARD DEVELOPMENT CO·Filed 2003·Granted Mar 1, 2005·2 cites·20 claims
- 1341US2003065498A1Software tool for generation of scattering parameter models of N-port lumped element circuits for use in spice simulatorsFiled 2001·Application pending·0 cites
- 1439US7203043B2Method and structure for external control of ESD protection in electronic circuitsHEWLETT PACKARD DEVELOPMENT CO·Filed 2003·Granted Apr 10, 2007·0 cites·10 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →