Inventor · disambiguated record
Pezhman Monadgemi
Also filed as: MONADGEMI PEZHMAN
41 granted patents·4 pending applications·784 citations·filing 2007–2024
98Inventor score
Files withINVENSAS CORP15WESTERN DIGITAL FREMONT LLC4MONADGEMI PEZHMAN3QUEVY EMMANUEL P3SILICON CLOCKS INC3
Top patents by PatentIndex Score
45 records- 0199US8518279B1Method and system for providing a laser cavity for an energy assisted magnetic recording headWANG LEI·Filed 2010·Granted Aug 27, 2013·148 cites·14 claims
- 0299US7923790B1Planar microshells for vacuum encapsulated devices and damascene method of manufactureSILICON LAB INC·Filed 2007·Granted Apr 12, 2011·127 cites·54 claims
- 0398US9502390B2BVA interposerINVENSAS CORP·Filed 2013·Granted Nov 22, 2016·59 cites·27 claims
- 0498US7659150B1Microshells for multi-level vacuum cavitiesSILICON CLOCKS INC·Filed 2007·Granted Feb 9, 2010·96 cites·18 claims
- 0597US8313970B2Planar microshells for vacuum encapsulated devices and damascene method of manufactureQUEVY EMMANUEL P·Filed 2011·Granted Nov 20, 2012·23 cites·36 claims
- 0697US8288835B2Microshells with integrated getter layerQUEVY EMMANUEL P·Filed 2011·Granted Oct 16, 2012·31 cites·26 claims
- 0797US7595209B1Low stress thin film microshellsSILICON CLOCKS INC·Filed 2007·Granted Sep 29, 2009·58 cites·12 claims
- 0896US8247216B2Ultra-high multiplex analytical systems and methodsZACCARIN DENIS·Filed 2009·Granted Aug 21, 2012·73 cites·8 claims
- 0995US8273594B2Planar microshells for vacuum encapsulated devices and damascene method of manufactureQUEVY EMMANUEL P·Filed 2011·Granted Sep 25, 2012·11 cites·29 claims
- 1095US7736929B1Thin film microshells incorporating a getter layerSILICON CLOCKS INC·Filed 2007·Granted Jun 15, 2010·42 cites·14 claims
- 1192US8993307B2High multiplex arrays and systemsZACCARIN DENIS·Filed 2012·Granted Mar 31, 2015·17 cites·14 claims
- 1292US8335029B2Micromirror arrays having self aligned featuresMONADGEMI PEZHMAN·Filed 2011·Granted Dec 18, 2012·12 cites·15 claims
- 1391US8981564B2Metal PVD-free conducting structuresINVENSAS CORP·Filed 2013·Granted Mar 17, 2015·11 cites·22 claims
- 1490US9212051B1Systems and methods for forming MEMS assemblies incorporating gettersMONADGEMI PEZHMAN·Filed 2011·Granted Dec 15, 2015·7 cites·9 claims
- 1590US9008139B2Structure and method for edge-emitting diode package having deflectors and diffusersJDS UNIPHASE CORP·Filed 2013·Granted Apr 14, 2015·15 cites·21 claims
- 1689US10297582B2BVA interposerINVENSAS CORP·Filed 2015·Granted May 21, 2019·6 cites·11 claims
- 1787US8518748B1Method and system for providing a laser submount for an energy assisted magnetic recording headWANG LEI·Filed 2011·Granted Aug 27, 2013·8 cites·21 claims
- 1884US7977136B2Microelectromechanical systems structures and self-aligned high aspect-ratio combined poly and single-crystal silicon fabrication processes for producing sameGEORGIA TECH RES INST·Filed 2009·Granted Jul 12, 2011·11 cites·9 claims
- 1983US8790996B2Method of processing a device substrateMONADGEMI PEZHMAN·Filed 2012·Granted Jul 29, 2014·5 cites·47 claims
- 2082US8757897B2Optical interposerKOSENKO VALENTIN·Filed 2012·Granted Jun 24, 2014·7 cites·52 claims
- 2179US9312175B2Surface modified TSV structure and methods thereofINVENSAS CORP·Filed 2012·Granted Apr 12, 2016·5 cites·16 claims
- 2277US10562766B2Nanoscale apertures having islands of functionalityPACIFIC BIOSCIENCES CALIFORNIA INC·Filed 2017·Granted Feb 18, 2020·1 cites·20 claims
- 2375US12191284B2Thermally efficient semiconductor device assemblies including interposers carrying a subset of the external contacts of the assembly, and methods of making the sameMICRON TECHNOLOGY INC·Filed 2023·Granted Jan 7, 2025·0 cites·19 claims
- 2473US9099482B2Method of processing a device substrateINVENSAS CORP·Filed 2014·Granted Aug 4, 2015·2 cites·20 claims
- 2572US9637380B2Nanoscale apertures having islands of functionalityTURNER STEPHEN·Filed 2011·Granted May 2, 2017·3 cites·16 claims
- 2670US9323010B2Structures formed using monocrystalline silicon and/or other materials for optical and other applicationsKOSENKO VALENTIN·Filed 2012·Granted Apr 26, 2016·3 cites·13 claims
- 2766US9123780B2Method and structures for heat dissipating interposersINVENSAS CORP·Filed 2012·Granted Sep 1, 2015·1 cites·19 claims
- 2864US11742328B2Thermally efficient semiconductor device assemblies including interposers carrying a subset of the external contacts of the assembly, and methods of making the sameMICRON TECHNOLOGY INC·Filed 2021·Granted Aug 29, 2023·0 cites·22 claims
- 2964US9601398B2Thin wafer handling and known good die test methodINVENSAS CORP·Filed 2014·Granted Mar 21, 2017·1 cites·15 claims
- 3063US9237648B2Carrier-less silicon interposerINVENSAS CORP·Filed 2013·Granted Jan 12, 2016·1 cites·19 claims
- 3163US2025385171A1Redistribution layers with ground pad extensions to supress crosstalkNVIDIA CORP·Filed 2024·Application pending·0 cites
- 3260US10475733B2Method and structures for heat dissipating interposersINVENSAS CORP·Filed 2018·Granted Nov 12, 2019·0 cites·9 claims
- 3359US9689800B2Process for making high multiplex arraysPACIFIC BIOSCIENCES CALIFORNIA INC·Filed 2014·Granted Jun 27, 2017·0 cites·13 claims
- 3457US8877358B1Method and system for providing a laser cavity for an energy assisted magnetic recording headWESTERN DIGITAL FREMONT LLC·Filed 2013·Granted Nov 4, 2014·0 cites·2 claims
- 3557US2024312919A1Interposer solution for high core count compute platformsINTEL CORP·Filed 2023·Application pending·0 cites
- 3656US10103094B2Method and structures for heat dissipating interposersINVENSAS CORP·Filed 2017·Granted Oct 16, 2018·0 cites·20 claims
- 3754US8860216B1Method and system for providing a laser submount for an energy assisted magnetic recording headWESTERN DIGITAL FREMONT LLC·Filed 2013·Granted Oct 14, 2014·0 cites·3 claims
- 3854US2016176705A1Systems and methods for forming mems assemblies incorporating gettersWESTERN DIGITAL FREMONT LLC·Filed 2015·Application pending·0 cites
- 3954US2016176706A1Systems and methods for forming mems assemblies incorporating gettersWESTERN DIGITAL FREMONT LLC·Filed 2015·Application pending·0 cites
- 4053US9685401B2Structures for heat dissipating interposersINVENSAS CORP·Filed 2015·Granted Jun 20, 2017·0 cites·16 claims
- 4152US9064933B2Methods and structure for carrier-less thin wafer handlingINVENSAS CORP·Filed 2012·Granted Jun 23, 2015·0 cites·15 claims
- 4250US9379008B2Metal PVD-free conducting structuresINVENSAS CORP·Filed 2015·Granted Jun 28, 2016·0 cites·8 claims
- 4349US10181411B2Method for fabricating a carrier-less silicon interposerINVENSAS CORP·Filed 2015·Granted Jan 15, 2019·0 cites·10 claims
- 4449US9355905B2Methods and structure for carrier-less thin wafer handlingINVENSAS CORP·Filed 2015·Granted May 31, 2016·0 cites·14 claims
- 4549US8846447B2Thin wafer handling and known good die test methodWOYCHIK CHARLES G·Filed 2012·Granted Sep 30, 2014·0 cites·35 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →