Inventor · disambiguated record
Peik Eng Ooi
Also filed as: OOI PEIK ENG
0 granted patents·3 pending applications·0 citations·filing 2023–2023
Technology areasH10W
Files withSTATS CHIPPAC PTE LTD3
Top patents by PatentIndex Score
3 records- 0146US2025096095A1Semiconductor Device and Methods of Making and Using Dummy Vias to Reduce Short-Circuits Between Solder BumpsSTATS CHIPPAC PTE LTD·Filed 2023·Application pending·0 cites
- 0239US2025054902A1Semiconductor Device and Method Using Lead Frame Interposer in Bump Continuity TestSTATS CHIPPAC PTE LTD·Filed 2023·Application pending·0 cites
- 0339US2024355760A1Semiconductor Device and Method of Forming Stress Relief Vias in Multi-Layer RDLSTATS CHIPPAC PTE LTD·Filed 2023·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →