Inventor · disambiguated record
Peter Ossimitz
Also filed as: OSSIMITZ PETER
17 granted patents·2 pending applications·74 citations·filing 2004–2016
90Inventor score
Top patents by PatentIndex Score
19 records- 0196US9362187B2Chip package having terminal pads of different form factorsINFINEON TECHNOLOGIES AG·Filed 2013·Granted Jun 7, 2016·46 cites·29 claims
- 0287US9082644B2Method of manufacturing and testing a chip packageINFINEON TECHNOLOGIES AG·Filed 2013·Granted Jul 14, 2015·12 cites·22 claims
- 0376US9204543B2Integrated IC packageINFINEON TECHNOLOGIES AG·Filed 2013·Granted Dec 1, 2015·4 cites·21 claims
- 0475US9385059B2Overmolded substrate-chip arrangement with heat sinkINFINEON TECHNOLOGIES AG·Filed 2013·Granted Jul 5, 2016·3 cites·19 claims
- 0573US9859251B2Semiconductor device having a chip under packageINFINEON TECHNOLOGIES AG·Filed 2016·Granted Jan 2, 2018·2 cites·22 claims
- 0663US7640469B2Electronic element comprising an electronic circuit which is to be tested and test system arrangement which is used to test the electronic elementINFINEON TECHNOLOGIES AG·Filed 2006·Granted Dec 29, 2009·4 cites·21 claims
- 0758US8399265B2Device for releasably receiving a semiconductor chipOSSIMITZ PETER·Filed 2011·Granted Mar 19, 2013·1 cites·24 claims
- 0855US8779577B2Semiconductor chip comprising a plurality of contact pads and a plurality of associated pad cellsOSSIMITZ PETER·Filed 2012·Granted Jul 15, 2014·1 cites·19 claims
- 0951US9651630B2Circuitry and method for monitoring a power supply of an electronic deviceINFINEON TECHNOLOGIES AG·Filed 2013·Granted May 16, 2017·0 cites·32 claims
- 1049US7560801B2Rewiring substrate strip with several semiconductor component positionsINFINEON TECHNOLOGIES AG·Filed 2005·Granted Jul 14, 2009·1 cites·24 claims
- 1148US9299673B2Method for manufacturing a semiconductor chip with each contact pad having a pad cell associated therewithINFINEON TECHNOLOGIES AG·Filed 2014·Granted Mar 29, 2016·0 cites·18 claims
- 1246US9219031B2Chip arrangement, and method for forming a chip arrangementINFINEON TECHNOLOGIES AG·Filed 2013·Granted Dec 22, 2015·0 cites·31 claims
- 1343US7501701B2Rewiring substrate strip having a plurality of semiconductor component positionsINFINEON TECHNOLOGIES AG·Filed 2006·Granted Mar 10, 2009·0 cites·12 claims
- 1441US10090251B2Semiconductor chip having a dense arrangement of contact terminalsINFINEON TECHNOLOGIES AG·Filed 2015·Granted Oct 2, 2018·0 cites·13 claims
- 1540US9871017B2Multi-level chip interconnectINFINEON TECHNOLOGIES AG·Filed 2016·Granted Jan 16, 2018·0 cites·32 claims
- 1640US7154116B2Rewiring substrate strip with a number of semiconductor component positionsINFINEON TECHNOLOGIES AG·Filed 2004·Granted Dec 26, 2006·0 cites·19 claims
- 1736US2005086564A1Multi-chip module and method for testingFiled 2004·Application pending·0 cites
- 1835US2005006726A1Apparatus and method for testing semiconductor nodules on a semiconductor substrate waferINFINEON TECHNOLOGIES AG·Filed 2004·Application pending·0 cites
- 1932US8799704B2Semiconductor memory component having a diverting circuitOSSIMITZ PETER·Filed 2007·Granted Aug 5, 2014·0 cites·27 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →