Inventor · disambiguated record
Pei Luan Pok
Also filed as: POK PEI LUAN
3 granted patents·2 pending applications·2 citations·filing 2017–2025
50Inventor score
Files withINFINEON TECHNOLOGIES AG5
Top patents by PatentIndex Score
5 records- 0168US10777536B2Semiconductor package with air cavityINFINEON TECHNOLOGIES AG·Filed 2018·Granted Sep 15, 2020·2 cites·22 claims
- 0259US2025257469A1Metal component including an intermetallic compound layer and method for manufacturing thereofINFINEON TECHNOLOGIES AG·Filed 2025·Application pending·0 cites
- 0349US2024312956A1Subtractive Metal Structuring on Surface of Semiconductor PackageINFINEON TECHNOLOGIES AG·Filed 2023·Application pending·0 cites
- 0447US11791169B2Dual step laser processing of an encapsulant of a semiconductor chip packageINFINEON TECHNOLOGIES AG·Filed 2020·Granted Oct 17, 2023·0 cites·21 claims
- 0540US10490470B2Semiconductor package and method for fabricating a semiconductor packageINFINEON TECHNOLOGIES AG·Filed 2017·Granted Nov 26, 2019·0 cites·11 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →