Inventor · disambiguated record
Petrina L. Schnabel
Also filed as: SCHNABEL PETRINA L
2 granted patents·140 citations·filing 1991–1994
67Inventor score
Files withDELCO ELECTRONICS CORP2
Top patents by PatentIndex Score
2 records- 0187US5400950AMethod for controlling solder bump height for flip chip integrated circuit devicesDELCO ELECTRONICS CORP·Filed 1994·Granted Mar 28, 1995·125 cites·9 claims
- 0249US5185498ACircuit assembly encapsulated with polybutadiene urethaneDELCO ELECTRONICS CORP·Filed 1991·Granted Feb 9, 1993·15 cites·4 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →