Inventor · disambiguated record
Peter Smeys
Also filed as: SMEYS PETER · SMEYS PETER I
79 granted patents·25 pending applications·652 citations·filing 1999–2025
99Inventor score
Top patents by PatentIndex Score
104 records- 0197US8222065B1Method and system for forming a capacitive micromachined ultrasonic transducerSMEYS PETER·Filed 2009·Granted Jul 17, 2012·90 cites·20 claims
- 0296US9422156B2Integrated CMOS and MEMS sensor fabrication method and structureINVENSENSE INC·Filed 2015·Granted Aug 23, 2016·17 cites·20 claims
- 0393US7902661B2Integrated circuit micro-moduleNAT SEMICONDUCTOR CORP·Filed 2009·Granted Mar 8, 2011·26 cites·10 claims
- 0493US7468899B1Apparatus and method for wafer level fabrication of high value inductors on semiconductor integrated circuitsNAT SEMICONDUCTOR CORP·Filed 2007·Granted Dec 23, 2008·23 cites·28 claims
- 0591US8482118B2Integrated circuit micro-moduleMOHAN ANURAAG·Filed 2012·Granted Jul 9, 2013·16 cites·13 claims
- 0691US8314676B1Method of making a controlled seam laminated magnetic core for high frequency on-chip power inductorsSMEYS PETER·Filed 2011·Granted Nov 20, 2012·12 cites·9 claims
- 0791US8187920B2Integrated circuit micro-moduleMOHAN ANURAAG·Filed 2011·Granted May 29, 2012·17 cites·5 claims
- 0891US7843056B2Integrated circuit micro-moduleNAT SEMICONDUCTOR CORP·Filed 2009·Granted Nov 30, 2010·23 cites·19 claims
- 0991US6433587B1SOI CMOS dynamic circuits having threshold voltage controlIBM·Filed 2000·Granted Aug 13, 2002·44 cites·12 claims
- 1090US10221065B2CMOS-MEMS integrated device including multiple cavities at different controlled pressures and methods of manufactureINVENSENSE INC·Filed 2017·Granted Mar 5, 2019·4 cites·15 claims
- 1190US9540228B2MEMS-CMOS device that minimizes outgassing and methods of manufactureINVENSENSE INC·Filed 2015·Granted Jan 10, 2017·4 cites·12 claims
- 1290US8878334B1Integrated circuit resistors with reduced parasitic capacitanceRATNAKUMAR ALBERT·Filed 2012·Granted Nov 4, 2014·12 cites·16 claims
- 1389US8609486B1Methods for fabricating deep trench capacitorsSMEYS PETER·Filed 2012·Granted Dec 17, 2013·13 cites·20 claims
- 1489US8048704B2Method of forming a MEMS topped integrated circuit with a stress relief layerNAT SEMICONDUCTOR CORP·Filed 2010·Granted Nov 1, 2011·10 cites·15 claims
- 1589US8044755B2MEMS power inductorNAT SEMICONDUCTOR CORP·Filed 2008·Granted Oct 25, 2011·15 cites·20 claims
- 1689US7755463B2Integrated circuits with inductorsNAT SEMICONDUCTOR CORP·Filed 2008·Granted Jul 13, 2010·14 cites·23 claims
- 1789US6323535B1Electrical fuses employing reverse biasing to enhance programmingINFINEON TECHNOLOGIES CORP·Filed 2000·Granted Nov 27, 2001·56 cites·16 claims
- 1888US9525068B1Variable gate width FinFETALTERA CORP·Filed 2013·Granted Dec 20, 2016·7 cites·9 claims
- 1987US7584533B2Method of fabricating an inductor structure on an integrated circuit structureNAT SEMICONDUCTOR CORP·Filed 2007·Granted Sep 8, 2009·12 cites·15 claims
- 2086US9738512B2CMOS-MEMS integrated device including multiple cavities at different controlled pressures and methods of manufactureINVENSENSE INC·Filed 2015·Granted Aug 22, 2017·3 cites·8 claims
- 2186US7936246B2On-chip inductor for high current applicationsNAT SEMICONDUCTOR CORP·Filed 2007·Granted May 3, 2011·15 cites·12 claims
- 2285US11646714B2Laterally vibrating bulk acoustic wave resonatorTEXAS INSTRUMENTS INC·Filed 2019·Granted May 9, 2023·4 cites·22 claims
- 2385US9796580B2CMOS-MEMS-CMOS platformINVENSENSE INC·Filed 2015·Granted Oct 24, 2017·4 cites·11 claims
- 2485US9761557B2CMOS-MEMS integration by sequential bonding methodINVENSENSE INC·Filed 2015·Granted Sep 12, 2017·3 cites·16 claims
- 2584US11190164B2Using acoustic reflector to reduce spurious modesTEXAS INSTRUMENTS INC·Filed 2019·Granted Nov 30, 2021·4 cites·20 claims
- 2684US9331137B1Metal-insulator-metal capacitors between metal interconnect layersRATAKONDA DEEPA·Filed 2012·Granted May 3, 2016·10 cites·18 claims
- 2782US8130067B2High frequency semiconductor transformerLEE DOK WON·Filed 2010·Granted Mar 6, 2012·8 cites·20 claims
- 2882US7705411B2MEMS-topped integrated circuit with a stress relief layerNAT SEMICONDUCTOR CORP·Filed 2008·Granted Apr 27, 2010·8 cites·19 claims
- 2981US9809450B2CMOS-MEMS integration using metal silicide formationINVENSENSE INC·Filed 2015·Granted Nov 7, 2017·2 cites·19 claims
- 3080US8822266B2Integrated circuit micro-moduleSMEYS PETER·Filed 2011·Granted Sep 2, 2014·5 cites·19 claims
- 3180US7901984B2Integrated circuit micro-moduleNAT SEMICONDUCTOR CORP·Filed 2009·Granted Mar 8, 2011·9 cites·13 claims
- 3280US7898068B2Integrated circuit micro-moduleNAT SEMICONDUCTOR CORP·Filed 2009·Granted Mar 1, 2011·9 cites·17 claims
- 3380US2025079340A1Through wafer trench isolation between transistors in an integrated circuitTEXAS INSTRUMENTS INC·Filed 2024·Application pending·0 cites
- 3479US10727815B2Methods and apparatus to measure resonant sensors based on detection of group delayTEXAS INSTRUMENTS INC·Filed 2019·Granted Jul 28, 2020·1 cites·18 claims
- 3579US6653710B2Fuse structure with thermal and crack-stop protectionIBM·Filed 2001·Granted Nov 25, 2003·27 cites·16 claims
- 3678US7901981B2Integrated circuit micro-moduleNAT SEMICONDUCTOR CORP·Filed 2009·Granted Mar 8, 2011·8 cites·19 claims
- 3778US7842544B2Integrated circuit micro-moduleNAT SEMICONDUCTOR CORP·Filed 2009·Granted Nov 30, 2010·8 cites·11 claims
- 3877US9862593B2MEMS-CMOS device that minimizes outgassing and methods of manufactureINVENSENSE INC·Filed 2016·Granted Jan 9, 2018·1 cites·19 claims
- 3977US8410576B2Inductive structure and method of forming the inductive structure with an attached core structureSMEYS PETER·Filed 2010·Granted Apr 2, 2013·5 cites·6 claims
- 4076US8042260B2Methods of forming inductors on integrated circuitsNAT SEMICONDUCTOR CORP·Filed 2008·Granted Oct 25, 2011·5 cites·23 claims
- 4175US9975763B2Integration of AIN ultrasonic transducer on a CMOS substrate using fusion bonding processINVENSENSE INC·Filed 2017·Granted May 22, 2018·1 cites·14 claims
- 4275US9754922B23D integration using Al—Ge eutectic bond interconnectINVENSENSE INC·Filed 2016·Granted Sep 5, 2017·2 cites·18 claims
- 4375US9725305B2Dual cavity pressure structuresINVENSENSE INC·Filed 2016·Granted Aug 8, 2017·1 cites·16 claims
- 4474US2025338774A1Acoustic isolatorTEXAS INSTRUMENTS INC·Filed 2025·Application pending·0 cites
- 4573US12148717B2Through wafer trench isolation between transistors in an integrated circuitTEXAS INSTRUMENTS INC·Filed 2022·Granted Nov 19, 2024·0 cites·16 claims
- 4670US8390093B1System and method of galvanic isolation in digital signal transfer integrated circuits utilizing conductivity modulation of semiconductor substrateHOPPER PETER J·Filed 2011·Granted Mar 5, 2013·3 cites·6 claims
- 4769US8274129B2Power transistor with improved high-side operating characteristics and reduced resistance and related apparatus and methodFRENCH WILLIAM·Filed 2009·Granted Sep 25, 2012·4 cites·6 claims
- 4869US2023253951A1Laterally Vibrating Bulk Acoustic Wave ResonatorTEXAS INSTRUMENTS INC·Filed 2023·Application pending·0 cites
- 4968US10308507B2MEMS gap control structuresINVENSENSE INC·Filed 2016·Granted Jun 4, 2019·1 cites·15 claims
- 5068US7461305B1System and method for detecting and preventing race condition in circuitsSUN MICROSYSTEMS INC·Filed 2005·Granted Dec 2, 2008·5 cites·15 claims
Showing the top 50 of 104 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →