Inventor · disambiguated record
Pei-Chun Tsai
Also filed as: TSAI PEI CHUN
20 granted patents·9 pending applications·160 citations·filing 2010–2025
92Inventor score
Files withTAIWAN SEMICONDUCTOR MFG CO LTD10HTC CORP5POWERTECH TECHNOLOGY INC4HON HAI PREC IND CO LTD2TAIWAN SEMICONDUCTOR MFG2
Top patents by PatentIndex Score
29 records- 0194USD905074SDisplay screen or portion thereof with graphical user interfaceHTC CORP·Filed 2019·Granted Dec 15, 2020·86 cites·1 claims
- 0294US10490468B2Semiconductor structure with conductive structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Nov 26, 2019·8 cites·20 claims
- 0394US9449941B2Connecting function chips to a package to form package-on-packageTSAI PEI-CHUN·Filed 2011·Granted Sep 20, 2016·44 cites·19 claims
- 0491US9871013B2Contact area design for solder bondingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2014·Granted Jan 16, 2018·10 cites·20 claims
- 0590US10157874B2Contact area design for solder bondingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Dec 18, 2018·6 cites·20 claims
- 0678US2025357224A1Device package and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 0770US2025266303A1Device package and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 0869US10877573B2Handheld apparatus, control method thereof of presenting mode and computer-readable recording mediumHTC CORP·Filed 2018·Granted Dec 29, 2020·1 cites·11 claims
- 0969US10838541B2Method for operating handheld device, handheld device and computer-readable recording medium thereofHTC CORP·Filed 2018·Granted Nov 17, 2020·1 cites·20 claims
- 1068US11088080B2Chip package structure using silicon interposer as interconnection bridgePOWERTECH TECHNOLOGY INC·Filed 2019·Granted Aug 10, 2021·1 cites·10 claims
- 1168US8823170B2Apparatus and method for three dimensional integrated circuitsTAIWAN SEMICONDUCTOR MFG·Filed 2012·Granted Sep 2, 2014·2 cites·20 claims
- 1264US10978363B2Semiconductor structure with conductive structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Apr 13, 2021·0 cites·20 claims
- 1364US10978362B2Semiconductor structure with conductive structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Apr 13, 2021·0 cites·20 claims
- 1459US10277186B2Calibration method and computer readable recording mediumASUSTEK COMP INC·Filed 2018·Granted Apr 30, 2019·1 cites·10 claims
- 1559US2025349811A1Semiconductor module including a corner die over a side of a semiconductor die, package structure including the semiconductor module and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 1658US10008459B2Structures having a tapering curved profile and methods of making sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2013·Granted Jun 26, 2018·0 cites·20 claims
- 1756US9935024B2Method for forming semiconductor structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Apr 3, 2018·0 cites·20 claims
- 1854US11506965B1Illumination system and projection deviceCORETRONIC CORP·Filed 2022·Granted Nov 22, 2022·0 cites·20 claims
- 1951US10768717B2Method for operating handheld device, handheld device and computer-readable recording medium thereofHTC CORP·Filed 2018·Granted Sep 8, 2020·0 cites·18 claims
- 2050US9006909B2Solder mask shape for BOT laminate packagesTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted Apr 14, 2015·0 cites·20 claims
- 2149US2023110079A1Fan-out package structure and manufacturing method thereofPOWERTECH TECHNOLOGY INC·Filed 2022·Application pending·0 cites
- 2247US2015369988A1Backlight module and display deviceYE XIN TECHNOLOGY CONSULTING CO LTD·Filed 2014·Application pending·0 cites
- 2346US10733706B2Mobile device, and image processing method for mobile deviceHTC CORP·Filed 2018·Granted Aug 4, 2020·0 cites·20 claims
- 2444US2021050294A1Fan-out chip package assembly and fan-out bottom package with fine pitch silicon through viaPOWERTECH TECHNOLOGY INC·Filed 2019·Application pending·0 cites
- 2543US2021050296A1Semiconductor package structure and manufacturing method thereofPOWERTECH TECHNOLOGY INC·Filed 2019·Application pending·0 cites
- 2641US8747696B2Phosphors and white light illumination devices utilizing the sameLIN JEN-CHUN·Filed 2010·Granted Jun 10, 2014·0 cites·4 claims
- 2741US8623756B2Reflow system and method for conductive connectionsCHUANG CHITA·Filed 2011·Granted Jan 7, 2014·0 cites·16 claims
- 2832US2015309368A1Display device having eye protection functionHON HAI PREC IND CO LTD·Filed 2015·Application pending·0 cites
- 2930US2015369989A1Backlight module and display deviceHON HAI PREC IND CO LTD·Filed 2015·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →