Inventor · disambiguated record
Peter Weitz
Also filed as: WEITZ PETER
8 granted patents·2 pending applications·100 citations·filing 2001–2008
87Inventor score
Top patents by PatentIndex Score
10 records- 0188US7352057B2Semiconductor module having an internal semiconductor chip stack, and method for producing said semiconductor moduleINFINEON TECHNOLOGIES AG·Filed 2005·Granted Apr 1, 2008·25 cites·9 claims
- 0286US7948071B2Integrated circuit with re-route layer and stacked die assemblyQIMONDA AG·Filed 2008·Granted May 24, 2011·13 cites·44 claims
- 0379US7422930B2Integrated circuit with re-route layer and stacked die assemblyINFINEON TECHNOLOGIES AG·Filed 2004·Granted Sep 9, 2008·25 cites·60 claims
- 0471US8624372B2Semiconductor component comprising an interposer substrateHETZEL WOLFGANG·Filed 2006·Granted Jan 7, 2014·6 cites·19 claims
- 0556US6897101B2Method for writing to the magnetoresistive memory cells of an integrated magnetoresistive semiconductor memoryINFINEON TECHNOLOGIES AG·Filed 2003·Granted May 24, 2005·10 cites·2 claims
- 0656US6721230B2Integrated memory with memory cells in a plurality of memory cell blocks, and method of operating such a memoryINFINEON TECHNOLOGIES AG·Filed 2002·Granted Apr 13, 2004·10 cites·12 claims
- 0750US6910161B2Device and method for reducing the number of addresses of faulty memory cellsINFINEON TECHNOLOGIES AG·Filed 2001·Granted Jun 21, 2005·7 cites·2 claims
- 0842US6608796B2Circuit configuration for controlling the word lines of a memory matrixINFINEON TECHNOLOGIES AG·Filed 2002·Granted Aug 19, 2003·4 cites·11 claims
- 0936US2005014394A1Contact-connection device for electronic circuit units and production methodINFINEON TECHNOLOGIES·Filed 2004·Application pending·0 cites
- 1034US2004189333A1Carrier for receiving and electrically contacting individually separated diesFiled 2004·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →