Inventor · disambiguated record
Peter Wrschka
Also filed as: DARSILLO MICHAEL · WRSCHKA PETER
11 granted patents·8 pending applications·292 citations·filing 2001–2022
92Inventor score
Top patents by PatentIndex Score
19 records- 0195US9038855B2Fluid processing systems and methodsLURCOTT STEVEN M·Filed 2010·Granted May 26, 2015·48 cites·18 claims
- 0294US6570256B2Carbon-graded layer for improved adhesion of low-k dielectrics to silicon substratesIBM·Filed 2001·Granted May 27, 2003·85 cites·11 claims
- 0392US7300601B2Passivative chemical mechanical polishing composition for copper film planarizationADVANCED TECH MATERIALS·Filed 2002·Granted Nov 27, 2007·45 cites·79 claims
- 0490US8304344B2High throughput chemical mechanical polishing composition for metal film planarizationBOGGS KARL E·Filed 2008·Granted Nov 6, 2012·26 cites·18 claims
- 0590US8236695B2Method of passivating chemical mechanical polishing compositions for copper film planarization processesLIU JUN·Filed 2008·Granted Aug 7, 2012·11 cites·20 claims
- 0688US6740539B2Carbon-graded layer for improved adhesion of low-k dielectrics to silicon substratesIBM·Filed 2003·Granted May 25, 2004·37 cites·11 claims
- 0784US7736405B2Chemical mechanical polishing compositions for copper and associated materials and method of using sameADVANCED TECH MATERIALS·Filed 2003·Granted Jun 15, 2010·28 cites·40 claims
- 0879US8507382B2Systems and methods for delivery of fluid-containing process material combinationsHUGHES JOHN E Q·Filed 2008·Granted Aug 13, 2013·8 cites·19 claims
- 0972US9586188B2Fluid processing systems and methodsENTEGRIS INC·Filed 2015·Granted Mar 7, 2017·2 cites·9 claims
- 1055US2007181852A1Passivative chemical mechanical polishing composition for copper film planarizationLIU JUN·Filed 2007·Application pending·0 cites
- 1145US2010248480A1Chemical mechanical polishing compositions for copper and associated materials and method of using sameADVANCED TECH MATERIALS·Filed 2010·Application pending·0 cites
- 1245US2010087065A1Stabilization of polymer-silica dispersions for chemical mechanical polishing slurry applicationsADVANCED TECH MATERIALS·Filed 2008·Application pending·0 cites
- 1344US6899597B2Chemical mechanical polishing (CMP) process using fixed abrasive padsINFINEON TECHNOLOGIES AG·Filed 2003·Granted May 31, 2005·2 cites·19 claims
- 1442US2025087569A1Filling materials and methods of filling viasSAMTEC INC·Filed 2022·Application pending·0 cites
- 1541US2016075971A1Copper cleaning and protection formulationsLIU JUN·Filed 2014·Application pending·0 cites
- 1641US2009215269A1Integrated chemical mechanical polishing composition and process for single platen processingADVANCED TECH MATERIALS·Filed 2006·Application pending·0 cites
- 1739US2006249482A1Chemical mechanical polishing compositions for step-ll copper line and other associated materials and method of using sameWRSCHKA PETER·Filed 2004·Application pending·0 cites
- 1837US6943114B2Integration scheme for metal gap fill, with fixed abrasive CMPINFINEON TECHNOLOGIES AG·Filed 2002·Granted Sep 13, 2005·0 cites·7 claims
- 1936US2003186551A1Integration scheme for metal gap fill with HDP and fixed abrasive CMPINFINEON TECHNOLOGIES CORP·Filed 2002·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →