Inventor · disambiguated record
Phillip E. Byrd
Also filed as: BYRD PHILLIP E
14 granted patents·4 pending applications·154 citations·filing 1998–2006
93Inventor score
Top patents by PatentIndex Score
18 records- 0192US7219418B2Method to prevent damage to probe cardMICRON TECHNOLOGY INC·Filed 2005·Granted May 22, 2007·16 cites·8 claims
- 0284US7143500B2Method to prevent damage to probe cardMICRON TECHNOLOGY INC·Filed 2001·Granted Dec 5, 2006·20 cites·13 claims
- 0380US6181616B1Circuits and systems for realigning data output by semiconductor testers to packet-based devices under testMICRON TECHNOLOGY INC·Filed 1999·Granted Jan 30, 2001·46 cites·25 claims
- 0478US6819132B2Method to prevent damage to probe cardMICRON TECHNOLOGY INC·Filed 2002·Granted Nov 16, 2004·12 cites·8 claims
- 0567US6762608B2Apparatus and method for testing fusesMICRON TECHNOLOGY INC·Filed 2002·Granted Jul 13, 2004·10 cites·44 claims
- 0665US6897672B2Apparatus to prevent damage to probe cardMICRON TECHNOLOGY INC·Filed 2002·Granted May 24, 2005·6 cites·12 claims
- 0765US6410352B2Apparatus and method for testing fusesMICRON TECHNOLOGY INC·Filed 2001·Granted Jun 25, 2002·9 cites·28 claims
- 0862US7116124B2Apparatus to prevent damage to probe cardMICRON TECHNOLOGY INC·Filed 2002·Granted Oct 3, 2006·5 cites·48 claims
- 0959US6809378B2Structure for temporarily isolating a die from a common conductor to facilitate wafer level testingMICRON TECHNOLOGY INC·Filed 2001·Granted Oct 26, 2004·6 cites·47 claims
- 1053US6424161B2Apparatus and method for testing fusesMICRON TECHNOLOGY INC·Filed 1998·Granted Jul 23, 2002·13 cites·25 claims
- 1151US2006114011A1Method to prevent damage to probe cardBYRD PHILLIP E·Filed 2006·Application pending·0 cites
- 1246US6374376B1Circuit, system and method for arranging data output by semiconductor testers to packet-based devices under testMICRON TECHNOLOGY INC·Filed 1998·Granted Apr 16, 2002·9 cites·4 claims
- 1344US6819161B2Structure for temporarily isolating a die from a common conductor to facilitate wafer level testingMICRON TECHNOLOGY INC·Filed 2002·Granted Nov 16, 2004·1 cites·29 claims
- 1444US2005060882A1Method to prevent damage to probe cardFiled 2004·Application pending·0 cites
- 1543US2006114010A1Method to prevent damage to probe cardBYRD PHILLIP E·Filed 2006·Application pending·0 cites
- 1638US6981199B2Method for arranging data output by semiconductor testers to packet-based devices under testMICRON TECHNOLOGY INC·Filed 2003·Granted Dec 27, 2005·0 cites·8 claims
- 1737US6760871B2Circuit, system and method for arranging data output by semiconductor testers to packet-based devices under testMICRON TECHNOLOGY INC·Filed 2001·Granted Jul 6, 2004·1 cites·36 claims
- 1837US2004051098A1Method and structure for temporarily isolating a die from a common conductor to facilitate wafer level testingFiled 2003·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →