Inventor · disambiguated record
Phillip R. Coffman
Also filed as: COFFMAN PHILLIP · COFFMAN PHILLIP R
9 granted patents·5 pending applications·184 citations·filing 1998–2012
89Inventor score
Files withTEXAS INSTRUMENTS INC6HEWLETT PACKARD CO2COFFMAN PHILLIP1COFFMAN PHILLIP R1PAGE STEPHEN K1
Top patents by PatentIndex Score
14 records- 0187US6204182B1In-situ fluid jet orificeHEWLETT PACKARD CO·Filed 1998·Granted Mar 20, 2001·55 cites·42 claims
- 0286US6869831B2Adhesion by plasma conditioning of semiconductor chip surfacesTEXAS INSTRUMENTS INC·Filed 2001·Granted Mar 22, 2005·35 cites·12 claims
- 0386US6315397B2In-situ fluid jet orificeHEWLETT PACKARD CO·Filed 2000·Granted Nov 13, 2001·25 cites·10 claims
- 0484US6514881B1Hybrid porous low-K dielectrics for integrated circuitsTEXAS INSTRUMENTS INC·Filed 2001·Granted Feb 4, 2003·34 cites·24 claims
- 0576USD637519SNon-metallic buckleCOFFMAN PHILLIP·Filed 2010·Granted May 10, 2011·27 cites·1 claims
- 0676US7319275B2Adhesion by plasma conditioning of semiconductor chipTEXAS INSTRUMENTS INC·Filed 2005·Granted Jan 15, 2008·5 cites·10 claims
- 0761US7445960B2Adhesion by plasma conditioning of semiconductor chipTEXAS INSTRUMENTS INC·Filed 2007·Granted Nov 4, 2008·1 cites·10 claims
- 0860US7276401B2Adhesion by plasma conditioning of semiconductor chip surfacesTEXAS INSTRUMENTS INC·Filed 2006·Granted Oct 2, 2007·1 cites·10 claims
- 0960US7271494B2Adhesion by plasma conditioning of semiconductor chip surfacesTEXAS INSTRUMENTS INC·Filed 2005·Granted Sep 18, 2007·1 cites·6 claims
- 1041US2012252965A1Non-metalic belt buckleCOFFMAN PHILLIP R·Filed 2011·Application pending·0 cites
- 1139US2004157450A1Waferlevel method for direct bumping on copper pads in integrated circuitsFiled 2004·Application pending·0 cites
- 1237US2013182179A1CCD camera architecture and methods of manufacturePAGE STEPHEN K·Filed 2012·Application pending·0 cites
- 1337US2003116845A1Waferlevel method for direct bumping on copper pads in integrated circuitsFiled 2002·Application pending·0 cites
- 1436US2004115934A1Method of improving contact resistanceFiled 2002·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →