Inventor · disambiguated record
Philip Ekkels
Also filed as: EKKELS PHILIP
3 granted patents·2 pending applications·1 citations·filing 2017–2021
46Inventor score
Top patents by PatentIndex Score
5 records- 0160US10186447B2Method for bonding thin semiconductor chips to a substrateIMEC VZW·Filed 2017·Granted Jan 22, 2019·1 cites·20 claims
- 0245US12135470B2Electroactive lens assemblyMORROW N V·Filed 2020·Granted Nov 5, 2024·0 cites·19 claims
- 0344US11467427B2Connector for an optical deviceMORROW N V·Filed 2018·Granted Oct 11, 2022·0 cites·16 claims
- 0444US2023296922A1Connector suitable for electronic glasses and electronic glasses comprising such a connectorMORROW N V·Filed 2021·Application pending·0 cites
- 0540US2022155617A1Method of Integrating an Electronic Device Into an Eyeglass Frame, and Electronic GlassesMORROW N V·Filed 2020·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →