Inventor · disambiguated record
Phil Geng
Also filed as: GENG PHIL
20 granted patents·29 pending applications·97 citations·filing 2000–2025
91Inventor score
Top patents by PatentIndex Score
49 records- 0190US6833615B2Via-in-pad with off-center geometryINTEL CORP·Filed 2000·Granted Dec 21, 2004·52 cites·22 claims
- 0283US10950958B2Memory module connector, memory module, and pivotable latchINTEL CORP·Filed 2018·Granted Mar 16, 2021·3 cites·11 claims
- 0381US12133357B2Cold plate architecture for liquid cooling of devicesINTEL CORP·Filed 2020·Granted Oct 29, 2024·1 cites·20 claims
- 0479US10888010B2Retention of dual in-line memory modulesINTEL CORP·Filed 2019·Granted Jan 5, 2021·2 cites·9 claims
- 0579US2025071938A1Cold plate architecture for liquid cooling of devicesINTEL CORP·Filed 2024·Application pending·0 cites
- 0676US12131977B2Electronic systems with inverted circuit board with heat sink to chassis attachmentINTEL CORP·Filed 2023·Granted Oct 29, 2024·0 cites·20 claims
- 0772US6622905B2Design and assembly methodology for reducing bridging in bonding electronic components to pads connected to viasINTEL CORP·Filed 2000·Granted Sep 23, 2003·26 cites·20 claims
- 0869US7208348B2Methods of fabricating a via-in-pad with off-center geometryINTEL CORP·Filed 2004·Granted Apr 24, 2007·12 cites·13 claims
- 0966US12334674B2DIMM retention assembly for compression mount technology and land grid array connector loadingINTEL CORP·Filed 2021·Granted Jun 17, 2025·0 cites·14 claims
- 1066US2025234478A1Patterned bolster plate and composite back plate for semiconductor chip lga package and cooling assembly retentionINTEL CORP·Filed 2025·Application pending·0 cites
- 1165US12453054B2Cooling assembly with strap element to diminish lateral movement of cooling mass during installation of the cooling massINTEL CORP·Filed 2022·Granted Oct 21, 2025·0 cites·20 claims
- 1265US11587597B2Connector retention mechanism for improved structural reliabilityINTEL CORP·Filed 2020·Granted Feb 21, 2023·0 cites·17 claims
- 1363US12494441B2BGA stiffener attachment with low Eolife adhesive strength at high solder joint stress area generated from enabling loadINTEL CORP·Filed 2022·Granted Dec 9, 2025·0 cites·25 claims
- 1463US12476167B2Semiconductor chip package thermo-mechanical cooling assemblyINTEL CORP·Filed 2022·Granted Nov 18, 2025·0 cites·18 claims
- 1563US12279395B2Patterned bolster plate and composite back plate for semiconductor chip LGA package and cooling assembly retentionINTEL CORP·Filed 2021·Granted Apr 15, 2025·0 cites·14 claims
- 1663US11842943B2Electronic systems with inverted circuit board with heat sink to chassis attachmentINTEL CORP·Filed 2020·Granted Dec 12, 2023·0 cites·22 claims
- 1763US2024413054A1Integrated circuit packages with fluid spacers to improve pin load distributionINTEL CORP·Filed 2024·Application pending·0 cites
- 1862US2025055217A1Pins for use in land grid arrayINTEL CORP·Filed 2024·Application pending·0 cites
- 1961US2025089192A1Composite backplate architectures for backside power delivery and associated methodsINTEL CORP·Filed 2024·Application pending·0 cites
- 2060US11495518B2Multi-surface heat sink suitable for multi-chip packagesINTEL CORP·Filed 2019·Granted Nov 8, 2022·1 cites·16 claims
- 2160US2025024593A1Apparatus and systems to retain a printed circuit board between mounting platesGENG PHIL·Filed 2024·Application pending·0 cites
- 2260US2024242740A1Dual in-line memory module retainerINTEL CORP·Filed 2024·Application pending·0 cites
- 2359US2025071924A1Tall DIMM Structural RetentionINTEL CORP·Filed 2024·Application pending·0 cites
- 2458US2025174922A1Damping elements for pin vibration fretting risk mitigationINTEL CORP·Filed 2023·Application pending·0 cites
- 2557US11984685B2Retention latch with spring mechanismINTEL CORP·Filed 2020·Granted May 14, 2024·0 cites·14 claims
- 2657US2024096741A1Cooling systems with main and remote cooling masses having integrated flexibilityINTEL CORP·Filed 2023·Application pending·0 cites
- 2757US2024355702A1Integrated circuit packages with dampeners to reduce vibration effectsGENG PHIL·Filed 2024·Application pending·0 cites
- 2855US2023038805A1Methods, systems, apparatus, and articles of manufacture to control load distribution of integrated circuit packagesINTEL CORP·Filed 2022·Application pending·0 cites
- 2955US2024179832A1Multi-entry socket power delivery structure and backplateGENG PHIL·Filed 2024·Application pending·0 cites
- 3054US12315780B2Technologies for processor loading mechanismsINTEL CORP·Filed 2021·Granted May 27, 2025·0 cites·10 claims
- 3154US12309966B2Thermally conductive chamber with stiffening structure for thermal cooling assembly of semiconductor chip package under high loading forceINTEL CORP·Filed 2021·Granted May 20, 2025·0 cites·17 claims
- 3254US2023273654A1Dual in-line memory module coverINTEL CORP·Filed 2023·Application pending·0 cites
- 3354US2024355759A1Localized damping elements for mitigating interconnect vibration damageINTEL CORP·Filed 2023·Application pending·0 cites
- 3453US12309933B2Magnetically secured semiconductor chip package loading assemblyINTEL CORP·Filed 2021·Granted May 20, 2025·0 cites·20 claims
- 3553US2023022058A1Back plates to support integrated circuit packages in sockets on printed circuit boards and associated methodsINTEL CORP·Filed 2022·Application pending·0 cites
- 3653US2024240688A1Mitigation of seismic event effects on liquid immersion cooling systemsGENG PHIL·Filed 2024·Application pending·0 cites
- 3753US2023092972A1Dimm cooling assembly with heat spreader anti-rotation mechanismINTEL CORP·Filed 2022·Application pending·0 cites
- 3852US2022210950A1Multilayer back plate with molded ceramic layerINTEL CORP·Filed 2022·Application pending·0 cites
- 3952US2023014898A1Methods and apparatus to improve pin contact of a component stackINTEL CORP·Filed 2022·Application pending·0 cites
- 4052US2024349457A1Damping assemblies for heat sinks and related methodsGENG PHIL·Filed 2024·Application pending·0 cites
- 4151US2022117079A1Cooling assembly with dampened oscillation responseINTEL CORP·Filed 2021·Application pending·0 cites
- 4251US2022117080A1Ball grid array chip (bga) package cooling assembly with bolster plateINTEL CORP·Filed 2021·Application pending·0 cites
- 4351US2023031457A1Methods, systems, apparatus, and articles of manufacture to crimp a tubeINTEL CORP·Filed 2022·Application pending·0 cites
- 4450US2024113479A1Socket interconnect structures and related methodsINTEL CORP·Filed 2022·Application pending·0 cites
- 4548US2021328370A1Leaf spring for improved memory module that conserves motherboard wiring spaceINTEL CORP·Filed 2021·Application pending·0 cites
- 4646US10790603B2Connector with relaxation mechanism for latchINTEL CORP·Filed 2019·Granted Sep 29, 2020·0 cites·17 claims
- 4736US2018252483A1Heatsink stiffener method and apparatusINTEL CORP·Filed 2017·Application pending·0 cites
- 4834US2020194332A1Multi-piece heat spreader for multi-chip packageINTEL CORP·Filed 2017·Application pending·0 cites
- 4929US2003047348A1Grid array mounting arrangementsFiled 2001·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →