Inventor · disambiguated record
Phillip M. Gibbs
Also filed as: GIBBS PHILLIP M · GIBBS PHILLIP MARTIN
10 granted patents·3 pending applications·660 citations·filing 2001–2013
92Inventor score
Technology areasA61F
Top patents by PatentIndex Score
13 records- 0190US8123814B2Method and appartus for acetabular reconstructionMERIDEW JASON D·Filed 2007·Granted Feb 28, 2012·54 cites·16 claims
- 0289US7291177B2Method and apparatus for acetabular reconstructionBIOMET MFG CORP·Filed 2002·Granted Nov 6, 2007·200 cites·32 claims
- 0387US6458161B1Method and apparatus for acetabular reconstructionBIOMET INC·Filed 2001·Granted Oct 1, 2002·218 cites·57 claims
- 0486US8551181B2Method and apparatus for acetabular reconstructionMERIDEW JASON D·Filed 2012·Granted Oct 8, 2013·19 cites·18 claims
- 0575US7713306B2Method and apparatus for acetabular reconstructionBIOMET MFG CORP·Filed 2003·Granted May 11, 2010·62 cites·31 claims
- 0669US9375316B2Method and apparatus for acetabular reconstructionBIOMET MFG LLC·Filed 2013·Granted Jun 28, 2016·3 cites·9 claims
- 0768US8066779B2Modular hip joint implantGIBBS PHILLIP M·Filed 2009·Granted Nov 29, 2011·10 cites·20 claims
- 0868US7641698B1Modular hip joint implantBIOMET MFG CORP·Filed 2004·Granted Jan 5, 2010·41 cites·23 claims
- 0963US6911100B1Method for controlling residual stress in prostheticsBIOMET INC·Filed 2002·Granted Jun 28, 2005·35 cites·36 claims
- 1060US7780739B2Method and apparatus for use of a metal-metal constrained linerBIOMET MFG CORP·Filed 2004·Granted Aug 24, 2010·18 cites·34 claims
- 1145US2006217815A1Modular prosthetic head having a flat portion to be implanted into a constrained linerBIOMET MFG CORP·Filed 2006·Application pending·0 cites
- 1240US2006009857A1Method and apparatus for surface hardening implantsGIBBS PHILLIP M·Filed 2004·Application pending·0 cites
- 1339US2004078083A1Modular prosthetic head having a flat portion to be implanted into a constrained linerFiled 2003·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →