Inventor · disambiguated record
Philip Hecker
Also filed as: HECKER JR PHILIP E · HECKER PHILIP E
2 granted patents·2 pending applications·126 citations·filing 1992–2001
69Inventor score
Files withTEXAS INSTRUMENTS INC2
Top patents by PatentIndex Score
4 records- 0183US5327327AThree dimensional assembly of integrated circuit chipsTEXAS INSTRUMENTS INC·Filed 1992·Granted Jul 5, 1994·93 cites·4 claims
- 0264US5646068ASolder bump transfer for microelectronics packaging and assemblyTEXAS INSTRUMENTS INC·Filed 1995·Granted Jul 8, 1997·33 cites·24 claims
- 0328US2002039874A1Temperature endpointing of chemical mechanical polishingFiled 2001·Application pending·0 cites
- 0424US2002013044A1HDP liner layer prior to HSQ/SOG deposition to reduce the amount of HSQ/SOG over the metal leadFiled 2001·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →