Inventor · disambiguated record
Phuah Kian Keung
Also filed as: KEUNG PHUAH KIAN
5 granted patents·16 citations·filing 2001–2019
73Inventor score
Technology areasH10W
Top patents by PatentIndex Score
5 records- 0165US11114367B2Molded integrated circuit packages and methods of forming the sameCARSEM M SDN BHD·Filed 2019·Granted Sep 7, 2021·1 cites·21 claims
- 0248US7288833B2Stress-free lead frameCARSEM M SDN BHD·Filed 2004·Granted Oct 30, 2007·5 cites·16 claims
- 0346US6867483B2Stress-free lead frameCARSEN SEMICONDUCTOR SDN BHD·Filed 2001·Granted Mar 15, 2005·7 cites·14 claims
- 0445US7786554B2Stress-free lead frameCARSEM M SDN BHD·Filed 2007·Granted Aug 31, 2010·0 cites·11 claims
- 0542US6544817B2Method for sawing a moulded leadframe packageCARSEM SEMICONDUCTOR SDN BHD·Filed 2001·Granted Apr 8, 2003·3 cites·1 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →